Additive manufacturing (AM) is considered an environmentally friendly manufacturing process that builds solid 3D structures layer-by-layer from a computer-aided design (CAD), resulting in reduced waste as opposed to conventional subtractive manufacturing. However, a significant challenge in AM is the extensive use of plastics, which lack a standardized recycling process. The insufficient adhesion between printed layers contributes to waste generated with AM. Therefore, it is important to prioritize sustainability as a design parameter for future AM materials. Dynamic Covalent Networks (DCNs) offer a potential solution by combining the desirable characteristics of thermosets and the recyclability of thermoplastics. DCNs undergo bond rearrangement reactions influenced by external stimuli like heat or light, leading to changes in their topology. Bond exchange reactions can occur through two mechanisms: dissociative, involving separate steps of bond breaking and forming, or associative, involving simultaneous bond breaking and forming. Recently, a phosphate triester based DCN was developed obtaining a neighboring 𝛽-hydroxyl group which could perform transesterification exchange reactions within the network via the formation of a cyclic phosphate triester intermediate in a dissociative manner. Based on this network rearrangement, we synthesized a network by reacting phos- phoric acid with a diglycidyl ether to perform ring-opening reactions which creates a pendent 𝛽-hydroxyl functional group assisted in neighboring group transesterification. The reversibility of the bond exchange reaction within the network was investigated with a heating and cooling cycle with Variable temperature (VT) 31P solid-state NMR (SSNMR). Furthermore, the network was reprocessable with compression molding at 130 ◦C. Fast re- laxation times of 5 seconds at 200 ◦C were observed. Additionally, frequency sweep and dynamic mechanical temperature analysis (DMTA) experiments showed profiles which were expected for a dissociative bond exchange mechanism. However, an increase of the storage modulus at 150 ◦C was observed, indicating a curing process of the network. Subsequently, similar experiments were performed on the cured network, in which a reduction of the dynamic properties of the network was noted, with a stress relaxation time of 114 seconds at 200 ◦C. DMTA and frequency sweep experiments confirmed its increased storage modulus as well. Nevertheless, the uncured network was reprocessable via extrusion at 200 ◦C, however, it required at least 50 min for the network to obtain a viscous flow behavior for optimal extrusion.