QY Li | TU Delft Repository

Library

local_library Home Repository

QL

QY Li

Conference paper (2)

Journal article (1)

3 records found

1

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

Journal article (2004) - DG Yang (author) , JS Liang (author) , QY Li (author) , L.J. Ernst (author) , GQ Zhang (author)

Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

Conference paper (2003) - JS Liang (author) , D Yang (author) , QY Li (author) , LJ Ernst (author) , GQ Zhang (author)

Warpage-based optimization of the curing profile for electronic packaging polymers

Conference paper (2003) - DG Yang (author) , K.M.B. Jansen (author) , QY Li (author) , JS Liang (author) , LJ Ernst (author) , GQ Zhang (author)