A.
4 records found
1
Authored
The risk of corrosion poses a challenge to meet the stringent reliability requirements of microelectronic devices that are used in harsh environments. Microelectronic devices are often encapsulated in polymer packaging materials, which protect them from corrosion. These polyme ...
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high loading of (silica) fillers ...
Ultrasonic welding is a promising technology to join fibre-reinforced thermoplastic composites. While current studies are mostly limited to fabric materials the applicability to unidirectional materials, as found in aerospace structures, would offer opportunities for joining p ...