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W.D. van Driel

242 records found

This paper investigates the effects of three ageing factors (chemical, humidity, and temperature) and their interactions on the physical properties and degradation of silicone sealant used in microelectronic applications. The thermal degradation of silicone sealants was investiga ...
This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varie ...
Solder fatigue is a key failure mode in the electronic industry. Monitoring the actual degradation of the solder under real-time conditions in any application would be extremely beneficial. In this chapter, we describe the combination of experimental material characterization wit ...
A significant challenge in the implementation of health monitoring systems for estimating the health state of devices is the lack of accurate information about design details. This challenge is particularly prominent in the field of power electronics, where both IC designers and ...
Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), ...
This paper introduces an ontology-based Digital Twin (DT) architecture for the lighting industry, integrating simulation models, data analytics, and visualization to represent luminaires. The ontology standardizes luminaire components, facilitating interoperability with design to ...
In this chapter, the past and present situations of the reliability domain are discussed. As of today, most industries are in the transfer from test-to-pass approaches to more advanced strategies. These strategies currently are to determine the reliability capability by applying ...
Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is ...
The increasing awareness of environmental concerns and sustainability underlines the importance of energy-efficient systems, renewable energy technologies, electric vehicles, and smart grids. Hence, stringent constraints and safety regulations have been prompted to meet reliabili ...
This study explores a novel approach to monitor the spectral emission of LEDs by estimating the spectral power distribution from the spectral sensor responses during an accelerated aging experiment. Two methods for reconstructing the actual LED spectra from sensor responses are p ...
The introduction of silicon carbide(SiC) has reduced the superiority of traditional silicon-based power module pack-aging strategies. As packaging strategies become increasingly complex, classical thermal modelling tools often prove inadequate in balancing efficiency with accurac ...
Board level reliability can be of high interest for automotive electronic components when exposed to vibration-prone environments. However, the absence of an industry standard for board level vibration testing poses several challenges in establishing a well-characterized test set ...
In this article, we provide a comprehensive review of defect formation at the atomic level in interfaces and gate oxides, focusing on two primary defect types: interface traps and oxide traps. We summarize the current theoretical models and experimental observations related to th ...

Unveiling Hidden Anomalies

A Hybrid Approach for Surface Mounted Electronics

Industrial assembly lines are the heartbeat of modern manufacturing, where precision and efficiency are paramount. This paper introduces a novel hybrid Explainable artificial intelligence (XAI) approach to enhance monitoring and analysis in industrial assembly. By fusing the powe ...
Silver sintering offers a promising landscape for Pb-free die attachment in electronics packaging. However, the sintered interface properties are highly process-dependent and deviate from bulk silver properties. Conventional measurement methods do not adequately capture the die-a ...
Power MOSFET dies in the automotive industry are becoming larger (>5 × 5 mm) and thinner (<50 µm) to meet high-performance and lifetime requirements. Ensuring the mechanical robustness of these large ultrathin chips is crucial for reliable electronic devices and high-throug ...
Solder joint failure is one of the most common board-level failure modes in electronic components. It is crucial for a next-generation reliability assessment method to have an in-situ health monitoring system in place to evaluate the current state of degradation. This is achieved ...
Prognostic monitoring of power quad flat no-lead (PQFN) packages with four distinct silver pastes, each varying in material composition (pure-Ag and resin-reinforced hybridAg) and sintering processes (pressure-assisted and pressureless), was investigated in this study. The PQFN p ...
Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This wor ...
The ability to accurately predict the reliability and lifetime of electronics is of great importance to the industry. The failure of the solder joint is of particular interest for these predictions, because of their susceptibility to failure under thermo-mechanical stress. Howeve ...