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W.D. van Driel

247 records found

Silicon-Carbide (SiC) MOSFETs are widely used in high-power and high-efficiency applications such as electric vehicles and power supplies. However, long-term reliability remains a critical concern, particularly under extreme operating conditions. This work aims to explain the hea ...
This paper investigates the effects of three ageing factors (chemical, humidity, and temperature) and their interactions on the physical properties and degradation of silicone sealant used in microelectronic applications. The thermal degradation of silicone sealants was investiga ...
In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porou ...

Meshless Simulation with the Material Point Method

A Micropump for Nerve Injury Treatment

A meshless method is used to simulate the Fluid-Structure Interaction (FSI) in a micropump intended to treat nerve injury. Conventional meshbased methods can suffer from mesh deformation and quality issues, and find it difficult to track the fluid-structure interface. The Materia ...
The heat produced within the device in its package depends on the power supplied to each IP block. The improper placement of an IP block with high power consumption can become a reliability risk for IC packages, as it can significantly affect the reliability of solder balls due t ...
Power MOSFET dies in the automotive industry are becoming larger (>5 × 5 mm) and thinner (<50 µm) to meet high-performance and lifetime requirements. Ensuring the mechanical robustness of these large ultrathin chips is crucial for reliable electronic devices and high-throug ...
The various application scenarios of triboelectric nanogenerator (TENG) have attracted increasing research interest, while one of the biggest challenges is the energy extraction efficiency. Due to the small and time-varying inherent capacitor in a TENG, the previous energy extrac ...
Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is ...
Electronic packages with solder interconnects, such as Chip Scale Packages (CSP) and Ball Grid Arrays (BGA), are extensively utilized in various applications, including cell phones, smartwatches, and electric vehicles. The advancements in technology and the features within these ...
Silver sintering offers a promising landscape for Pb-free die attachment in electronics packaging. However, the sintered interface properties are highly process-dependent and deviate from bulk silver properties. Conventional measurement methods do not adequately capture the die-a ...
The ability to accurately predict the reliability and lifetime of electronics is of great importance to the industry. The failure of the solder joint is of particular interest for these predictions, because of their susceptibility to failure under thermo-mechanical stress. Howeve ...
A triboelectric nanogenerator (TENG) is a kinetic energy transducer with small and time-varying internal capacitance, which increases the difficulties of extracting harvested energy. In this paper, an efficient rectifier, hybridizing synchronized electric charge extraction (SECE) ...
The increasing awareness of environmental concerns and sustainability underlines the importance of energy-efficient systems, renewable energy technologies, electric vehicles, and smart grids. Hence, stringent constraints and safety regulations have been prompted to meet reliabili ...
Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), ...
This study introduces a training protocol utilizing Convolutional Neural Networks (CNNs) and Confocal Scanning Acoustic Microscopy (CSAM) imaging techniques to classify Power Quad Flat No-leads (PQFN) package delamination. The investigation involves empty PQFN packages with varie ...

Unveiling Hidden Anomalies

A Hybrid Approach for Surface Mounted Electronics

Industrial assembly lines are the heartbeat of modern manufacturing, where precision and efficiency are paramount. This paper introduces a novel hybrid Explainable artificial intelligence (XAI) approach to enhance monitoring and analysis in industrial assembly. By fusing the powe ...
This paper introduces an ontology-based Digital Twin (DT) architecture for the lighting industry, integrating simulation models, data analytics, and visualization to represent luminaires. The ontology standardizes luminaire components, facilitating interoperability with design to ...
Prognostic monitoring of power quad flat no-lead (PQFN) packages with four distinct silver pastes, each varying in material composition (pure-Ag and resin-reinforced hybridAg) and sintering processes (pressure-assisted and pressureless), was investigated in this study. The PQFN p ...
Due to the deficient passivation of the interface between silicon carbide and silicon dioxide, the defect-induced capture and release of trapped charges triggered by external Bias Temperature Stress (BTS) leads to parameter shifts and degraded device performance. This study model ...
Solder joint failure is one of the most common board-level failure modes in electronic components. It is crucial for a next-generation reliability assessment method to have an in-situ health monitoring system in place to evaluate the current state of degradation. This is achieved ...