GZ

G.Q. Zhang

670 records found

The three-step wet etching (TSWE) method has been proven to be a promising technique for fabricating silicon nanopores. Despite its potential, one of the bottlenecks of this method is the precise control of the silicon etching and etch-stop, which results in obtaining a well-defi ...
Van der Waals heterojunctions (vdWHs) have garnered significant attention for their promising applications in optoelectronics, attributed to their exceptional physical attributes. In this study, we present a straightforward approach to fabricating high-performance vdWHs photodete ...
This article compares and evaluates the single pulse short-circuit robustness of silicon carbide (SiC) MOSFETs with linear and hexagonal cell topologies under different gate voltages, bus voltages, and case temperatures. The short-circuit failure mechanisms of the linear and hexa ...
Sintered Cu nanoparticles (NPs) are promising for high-performance electronics due to their excellent thermal and electrical conductivity, as well as mechanical reliability. This study investigates the microscale mechanical behavior of sintered Cu NPs with a bimodal particle size ...
This paper investigates the effects of three ageing factors (chemical, humidity, and temperature) and their interactions on the physical properties and degradation of silicone sealant used in microelectronic applications. The thermal degradation of silicone sealants was investiga ...
This Letter presents a combined analytical and experimental method to effectively decouple the radial and tangential residual stress fields induced by Berkovich nanoindentation in single-crystalline 4H-SiC using micro-Raman spectroscopy. By integrating the Raman stress characteri ...
In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porou ...
This study investigates the interface strength and fracture behavior of sintered copper (Cu) nanoparticles (NPs) for all-Cu integration in advanced microelectronics packaging. Micro-cantilever bending tests on three configurations (Cu NP-notched, interface-notched and un-notched ...
The heat produced within the device in its package depends on the power supplied to each IP block. The improper placement of an IP block with high power consumption can become a reliability risk for IC packages, as it can significantly affect the reliability of solder balls due t ...
This article presents a novel in-package relative humidity (RH) sensor designed to enhance moisture detection within the chip encapsulation material, specifically epoxy molding compound (EMC). Traditional methods for assessing EMC moisture content, such as mass measurements, are ...
The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced electronics packaging. In this study, we explore the anisotropy in the microstructure and mechanical properties of sintered copper (Cu) NPs by combining experimental techniques with molec ...
The use of microRNAs as clinical cancer biomarkers is hindered by the absence of accurate, sensitive and rapid assays for their detection in biofluids. Here we report a biosensing approach, SpLig-HEMT, that combines an RNA splint-ligation reaction with an AlGaN/GaN high-electron- ...
Power electronics devices, pivotal in advancing electronic system technology, are essential for energy saving, enhancing power control efficiency, reducing noise, and minimizing size and volume. The evolution of power modules is based on innovative packaging structures, technolog ...
This study investigates the size-dependent mechanical behavior and deformation mechanisms of sintered copper (Cu) nanoparticles (NPs) through micro-pillar (2–6 μm diameter) compression tests, scanning electron microscopy (SEM), transmission electron microscopy (TEM), transmission ...
The 1.2 kV SiC VDMOSFETs with varied JFET width (LJFET) are designed and fabricated in this study. The static and dynamic characteristics of each design are measured and compared. There is the best trade-off performance in the design of LJFET = 1.8 μm according to FOM (BV2/Ron) a ...
The degradation mechanisms of silicon carbide (SiC) VDMOSFET and trench metal oxide semiconductor field effect transistor (MOSFET) in a 60Co gamma irradiation environment were investigated. The degradation of electrical characteristics of SiC MOSFET in different working states af ...
Sintered materials have been widely applied, as an alternative to soldering, for power electronics packaging. One key issue for such die-attach material is to characterize the actual porosity, which is difficult to obtain through SEM cross-section analysis. Therefore, in this wor ...
Triboelectric nanogenerator (TENG), advantageous in high energy density and flexibility, is promising as a sustainable energy source but can hardly be used to power edge devices directly due to its high-voltage AC output and varying capacitive impedance. To address it, this work ...
This study presents a novel approach for localized silver (Ag) nanoparticles (NPs) sintering using microheater arrays embedded within the Si substrate. By applying controlled pulse currents, these microheaters generate targeted heat pulses, enabling rapid and localized sintering ...
Graphdiyne (GDY)/two-dimensional materials (2DMs) heterostructures present unique opportunities for advanced optoelectronic and neuromorphic devices because of their exceptional electrical, optical, and structural properties. However, the traditional methods for construction of G ...