The primary challenges posed by oral mucosal diseases are their high incidence and the difficulty in managing symptoms. Inspired by the ability of bioelectricity to activate cells, accelerate metabolism, and enhance immunity, a conductive polyacrylamide/sodium alginate crosslinked hydrogel composite containing reduced graphene oxide (PAA-SA@rGO) is developed. This composite possesses antibacterial, anti-inflammatory, and antioxidant properties, serving as a bridge to turn the “short circuit” of the injured site into a “completed circuit,” thereby prompting fibroblasts in proximity to the wound site to secrete growth factors and expedite tissue regeneration. Simultaneously, the PAA-SA@rGO hydrogel effectively seals wounds to form a barrier, exhibits antibacterial and anti-inflammatory properties, and prevents foreign bacterial invasion. As the electric field of the wound is rebuilt and repaired by the PAA-SA@rGO hydrogel, a 5 × 5 mm2 wound in the full-thickness buccal mucosa of rats can be expeditiously mended within mere 7 days. The theoretical calculations indicate that the PAA-SA@rGO hydrogel can aggregate and express SOX2, PITX1, and PITX2 at the wound site, which has a promoting effect on rapid wound healing. Importantly, this PAA-SA@rGO hydrogel has a fast curative effect and only needs to be applied for the first three days, which significantly improves patient satisfaction during treatment.@en

Owing to the outstanding physical properties of graphene, its biosensing applications implemented by the terahertz metasurface are widely concerned and studied. Here, we present a novel design of the graphene metasurface, which consists of an individual graphene ring and an H-shaped graphene structure. The graphene metasurface exhibits a dual-resonance response, whose resonance frequency strongly varies with the geometrical parameters of the proposed metasurface, the carrier density of graphene, and the analyte composition. The transparency window, including width and position, can be artificially controlled by adjusting the geometrical parameters or the Fermi energy. Furthermore, the sensing parameters of the graphene metasurface for cancerous and normal cells are investigated, focusing on two factors, namely cell quantity and position on the metasurface. The simulated results clearly show that the theoretical sensitivity, figure of merit, and quantity of the graphene metasurface for breast cells reach 1.21 THz/RIU, 2.75 RIU (Formula presented.), and 2.43, respectively. Our findings may open up new avenues for promising applications in the diagnosis of cancers.@en

Reducing the thermal conductivity of thermoelectric materials has been a field of intense research to improve the efficiency of thermoelectric devices. One approach is to create a nanostructured thermoelectric material that has a low thermal conductivity due to its high number of grain boundaries or voids, which scatter phonons. Here, we present a new method based on spark ablation nanoparticle generation to create nanostructured thermoelectric materials, demonstrated using Bi2Te3. The lowest achieved thermal conductivity was <0.1 W m−1 K−1 at room temperature with a mean nanoparticle size of 8±2 nm and a porosity of 44%. This is comparable to the best published nanostructured Bi2Te3 films. Oxidation is also shown to be a major issue for nanoporous materials such as the one here, illustrating the importance of immediate, air-tight packaging of such materials after synthesis and deposition.@en

Understanding the atomic diffusion features in metallic material is significant to explain the diffusion-controlled physical processes. In this paper, using electromigration experiments and molecular dynamic (MD) simulations, we investigate the effects of grain size and temperature on the self-diffusion of polycrystalline aluminium (Al). The mass transport due to electromigration are accelerated by increasing temperature and decreasing grain size. Magnitudes of effective diffusivity (Deff) and grain boundary diffusivity (DGBs) are experimentally determined, in which theDeffchanges as a function of grain size and temperature, butDGBsis independent of the grain size, only affected by the temperature. Moreover, MD simulations of atomic diffusion in polycrystalline Al demonstrate those observations from experiments. Based on MD results, the Arrhenius equation ofDGBsand empirical formula of the thickness of grain boundaries at various temperatures are obtained. In total,DeffandDGBsobtained in the present study agree with literature results, and a comprehensive result of diffusivities related to the grain size is presented.@en

In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. In this paper, we conducted aging tests on sintered silver nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the sample under the dry high-sulphur conditions at a high temperature exhibited the highest degree of sulphidation; (2) Reactive force field (ReaxFF) molecular dynamics (MD) simulations of sintered silver nanoparticle sulphidation revealed the sulphidation layer was formed by silver atoms upward migration. This work paves the way for further investigation on sintered silver nanoparticles corrosion considering multi-physics coupling effects.@en

YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore the potential of blue laser-excited YAG: Ce3+ phosphor/silicone composites, the luminous performances under different blue laser power conditions were characterized by both the reflective and transmissive excitations using a self-built three-integrating-sphere system. Furthermore, the Monte-Carlo Ray-tracing simulation was used to illustrate the light-transmission and energy conversion mechanism in the phosphor/silicone composites. The results showed that: (1) The YAG: Ce3+ phosphor/silicone composite could be excited by the 0.292W laser light with the peak wavelength of 445nm, excessive laser power will cause phosphor thermal quenching and silicone carbonization. (2) The luminous flux of the composite under both the reflective and transmissive excitations gradually increased with the increase of phosphor concentration; correspondingly, the color coordinate moved to the yellow region, and the Correlated Color Temperature (CCT) gradually decreased. (3) The simulation results indicated that under the same phosphor concentration, the luminous flux obtained by reflection excitation was largely higher than that by the transmission excitation, as the light re-conversion and strong back-scattering were occurred in the reflective and transmissive laser excitation respectively.@en

In this paper, we presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis. Firstly, for layered or patterned structures, a homogenized equivalent model, with equivalent orthotropic material properties, gives excellent agreement with the exact finite element model solutions. Such a simplified finite element model provides an efficient way for structural parameter optimization. Secondly, the finite element mesh should keep the fixed size and shape at the location of interest where the singular point exists. This approach provides a simple way for relative stress comparison in different designs, although the absolute value of stress components has no actual meaning. Thirdly, to further eliminate the mesh dependency, the volume averaging method can be used. We extended the local volume averaging method for large-area die attach problems. Fourthly, in this paper, we presented a comparison study between linear elastic and nonlinear viscoplastic analysis, and demonstrated that in some cases, two different types of analysis give opposite trend results. Lastly, we demonstrated that with the use of different stress components, the conclusions may be different. We also provided an ANSYS APDL script in the supplemental material as a benchmark example.@en

Nano copper sintering technology has great potential to be widely applied in the wide-bandgap semiconductor packaging. In order to investigate the coalescence kinetics of copper nano particles for this application, a molecular dynamic (MD) simulation was carried out at low temperature on a special model containing two substrate and multiple particles in between. Accordingly, thorough microstructure and dislocation investigation was conducted to identify the atomic-scale evolution in the system. The corresponding findings could provide evidence on the new particle-substrate sintering mechanism. Furthermore, atomic trajectories tracking method was applied to study the rotation behavior of different sized nano particles. New rotation behavior and mechanism were described. Additionally, the study on the size effect of copper particles on the sintering process and coalescence mechanism was conducted via comparing the microstructural and dislocation distribution of 3 nm, 4 nm and 5 nm models. Finally, by comparing the MSD results at low and high temperature for each model, the dominant coalescence dynamics changes were obtained.@en

This paper studied the behaviors of sintering between Ag nanoparticle (NP) and nanoflake (NF) in the same size by molecular dynamics simulation. Before the sintering simulation, the melting simulation of NF was carried out to calculate the melting points of NFs and investigate the thermostability of NF. The Lindemann index and potential energy showed that the melting points of NF were significantly size-dependent. During the heating process, the sharp corner of NF transformed to the round corner and could bend spontaneously lower than melting points. In sintering simulation, the sintering process of NF-NP showed a metastable stage before equilibrium. Under low sintering temperature (500 K), the degree of plasticity sintering mechanism of NF-NP was more prominent, which generated more defects, such as amorphous atoms, dislocations, and stacking faults, than NP-NP. The sintered products of NF-NP also presented a better neck size and shrinkage than NP-NP in the same size. A new sintering behavior was observed: NF was bent toward the NP during the sintering. The bending curvature of NF increased as the thickness or the length/width decreased. For the NF with the ratio of length/width to thickness of 5:1, bending could further significantly facilitate neck growth. At 700 K, the plasticity mechanism dominated both the sintering processes of NF-NP and NP-NP. And NF-NP showed a larger diffusivity than NP-NP. At last, we investigated the effects of crystal misorientation, and found that a tilted grain boundary generated in the neck. The NF had the trend of rotation to decrease the crystal misorientation.@en

In a light-emitting diode (LED) package, silicone encapsulant serves as a chip protector and enables the light to transmit, since it exhibits the advantages of high light transmittance, high refractive index, and high thermal stability. However, its reliability is still challenged under harsh operation conditions. In this study, the optical and mechanical properties of silicone encapsulant, including appearance, light transmittance, Young’s modulus, and tensile strength, were experimentally monitored during the sulfur-rich ageing process. Meanwhile, the Fourier transform infrared (FTIR) spectroscopy and molecular dynamics (MD) simulation were used to reveal its degradation mechanism. The results show that 1) in the sulfur (S8)-rich ageing process, the severe vulcanization reaction occurred in silicone encapsulant assisted only by high temperature and high moisture, with the existence of H2S as the reaction product of S8 and H2O vapor. 2) Vulcanization characterized by the formation of the sulfhydryl (-SH) group lowered both optical and mechanical properties of silicone encapsulant. 3) The hydrolysis reaction featured by the formation of the hydroxyl (-OH) group decreased the mechanical performances of silicone encapsulant but brought slight harm to its optical performances.@en

Board level vibration testing is intended to assess prediction of the reliability of solder joint interconnects that are formed between electronic components and printed circuit boards (PCB). Frailties in the stress test experiment might lead to false board level reliability (BLR) evaluations. Therefore, it is essential to have a well-characterized board level vibration test method. Currently, there is no industrial test standard that prescribes board level vibration test method for electronic components at the PCB level. This paper examines the vibration test standards that are currently available in the industry and their applicability at the solder joint interconnect level. Next to that, it surveys the state-of-the-art board level vibration test setups and their impact on PCB dynamic loading and reliability at solder joint-PCB interface. It collates research on major building blocks of a board level vibration test method that includes vibration measurement techniques, PCB assemblies under test, board mounting schemes, operating environments, fault detection systems, and vibration test stress conditions that are currently used in the domain of solder joint level vibration testing. The findings from this paper are expected to reveal pitfalls and challenges while setting up board level vibration test experiments for electronic components. In addition, this paper attempts to identify research efforts that are required to make board level vibration testing a more credible means for assessing solder joint reliability. Outcomes from this study can further be used to guide future board level vibration specifications for electronic components.@en

The natural design and coupling of biological structures are the root of realizing the high strength, toughness, and unique functional properties of biomaterials. Advanced architecture design is applied to many materials, including metal materials, inorganic nonmetallic materials, polymer materials, and so on. To improve the performance of advanced materials, the designed architecture can be enhanced by bionics of biological structure, optimization of structural parameters, and coupling of multiple types of structures. Herein, the progress of structural materials is reviewed, the strengthening mechanisms of different types of structures are highlighted, and the impact of architecture design on the performance of advanced materials is discussed. Architecture design can improve the properties of materials at the micro level, such as mechanical, electrical, and thermal conductivity. The synergistic effect of structure makes traditional materials move toward advanced functional materials, thus enriching the macroproperties of materials. Finally, the challenges and opportunities of structural innovation of advanced materials in improving material properties are discussed.@en

The development of high-performance gas sensing materials is one of the development trends of new gas sensor technology. In this work, in order to predict the gas-sensitive characteristics of HfSe2 and its potential as a gas-sensitive material, the interactions of nonmetallic element (O, S, Te) doped HfSe2 monolayer and small molecules (NH3 and O3) have been studied by first-principles based on density functional theory. The results show that the adsorption of NH3 and O3 on pristine HfSe2 monolayer is weak, and the adsorption strength can be significantly improved by doping O. And O-HfSe2 is chemical adsorption to O3 with large adsorption energy and transfer charge, and the band gap of O[sbnd]HfSe2 disappears after adsorbing O3, indicating that the adsorption of O3 has a significant effect on the electrical properties of the substrate. These mean that O3 is difficult to recover from the substrate surface, thus preventing O-HfSe2 from developing into a sensitive material for O3 detection. After doping S, the charge transfers and adsorption strength to NH3 are the largest, but it is still small. So, the strain effect on the S-HfSe2/NH3 adsorption system is also studied. The results indicate that the adsorption strength of S-HfSe2 to NH3 can be enhanced by stretching S-HfSe2 along x-axis. After absorbing NH3, the conductivity of x-axis strained S-HfSe2 changes, which suggest its sensitivity. And the predicted recovery times of S-HfSe2 surfaces with εx=4%, 6% and 8% are 0.027 s, 1.153 s and 102.467 s, respectively, which suggests that the S-HfSe2 monolayer has the potential to be developed as a sensitive material for NH3 detection. These adsorption mechanism studies can also serve as a theoretical foundation for the experimental design of gas-sensing materials.@en

This paper presented integrated electromigration (EM) studies through experiment, theory, and simulation. First, extensive EM tests were performed using Blech and standard wafer-level electromigration acceleration test (SWEAT)-like structures, which were fabricated on four-inch wafers. Second, a molecular dynamics (MD) simulation-based diffusion-induced strain was incorporated into the existing coupled theory. Third, one-dimensional (1D) governing equations in terms of atomic concentration for un-passivated and passivated configurations were derived for void formation and growth, using a modified Eshelby's solution to consider the effect of passivation. Fourth, a systematic approach was established, including theoretical formulations and experimental methods, to obtain key material properties, i.e., critical atomic concentration and diffusivity. We then determined the material's properties from a specific set of experimental data, using aluminium (Al) as a carrier for demonstration. These properties were then used to predict the time to failure and void growth under various conditions. The theoretical results agreed well with the experimental data. Moreover, we theoretically determined the critical threshold products of current density and conductor length for the un-passivated and passivated configurations, respectively. Both experiment and theory showed that, in the absence of mechanical stress in un-passivated configurations, the atomic self-diffusion, which was opposite to electron wind, was significant in resisting EM development. However, when mechanical stress was present, such as in passivated configurations, stress migration played a dominant role in resisting EM development. Our numerical results showed that the current density exponent n in Black's law remained as 2 in the range of the current density greater than 0.2 MA/cm2 and rapidly approached infinity at a low level of current density.@en

This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of our study (Cui et al., 2023a), the experimental and numerical results with the current density of 1 MA/cm2 were presented. We observed that Al stripes with a SWEAT structure did not show damage in the entire length, while Blech structures showed void and hillock formations only at the cathode and anode, respectively. The temperature gradient owing to Joule heating was neglected in our previous simulations, and the predicted results agreed well with the experimental observations. However, we have not theoretically verified the effect of the temperature gradient. In this paper, we first reported the new experimental data under the elevated current densities of 3 and 5 MA/cm2. In both Blech and SWEAT structures, the spreading of voids in the middle region of conductors was observed. Moreover, in Blech structures, voiding in the middle region occurred after a period of time when voids/hillocks were formed at the cathode and anode, while the SWEAT structures did not show damage at the two ends. Next, based on the coupled 3D theory (Cui et al., 2023a), new analytical one-dimensional (1D) solutions were derived for the Blech and SWEAT structures in the un-passivated configuration considering TM. We found that TM played a significant role in the EM development in the middle of conductors under the elevated current density. The numerical results were in excellent agreement with the experimental data with the consideration of TM. We further established new EM failure's threshold criteria for the SWEAT structures in the form of the product of current density and square of conductor length. This is a major departure from the original Blech's theory in which only mechanical stress gradient was considered. We also studied the acceleration factor of the current density exponent and presented an insight into failure mechanisms associated with TM.@en

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In this study, the tensile deformation behaviors of sintered nanoCu paste were firstly characterized by high-temperature tensile tests performed at various temperatures and strain rates ranging from 180 °C to 360 °C, 1 × 10−4 s−1 to 1 × 10−3 s−1 respectively. It was found that the elastic modulus and tensile strength decreased at the higher tensile temperature while the ductility increased accordingly. The highest elastic modulus and tensile strength results were 12.15 GPa and 46.97 MPa, respectively. Second, failure analysis was conducted based on the fracture surface after tensile testing. Recrystallization was revealed as the main factor for ductility improvement. Subsequently, an Anand model was fitted by stress-strain curves to describe the tensile constitutive behavior of the sintered nanoCu paste. Multi-scale modelling techniques also investigated the impact of tensile temperature and strain rate on the tensile response. Molecular dynamics simulation was implemented using a hemispherical Cu nanoparticle model to reveal the properties from an atomistic perspective. In addition, a two-dimensional equivalent model was further established by using a stochastically distributed void morphology. The multi-scale modelling techniques successfully describe the evolution of tensile response to the different tensile temperatures and strain rates. Besides, the equivalent model with random void morphology was demonstrated as the finite element simulation results were highly consistent with the high-temperature tensile experiments.@en

Nanosilver pastes have been regarded as the most promising die-attach materials for high-temperature and high-power applications due to their advantages such as excellent thermal conductivity, electrical conductivity, high temperature resistance, and good shear strength. However, the common hot pressing sintering process for nanosilver pastes has the limitations of long sintering time and complicated sintering processes. Thus, laser sintering has been proposed as a rapid sintering method that attracts increasing interest due to its advantages of high energy density, fast temperature rise, easy densification, etc. In this review, the recent advances in laser sintering processes were summarized, including pressure laser sintering, backside sintering, and hybrid bimodal laser sintering. The effects of various laser sintering process parameters on joint performance, such as laser power, sintering pressure, irradiation time, and defocusing amount, were further discussed. The rapid sintering mechanism of laser sintering silver nanoparticles(AgNPs) was revealed, while microscopic explanations need to be further explored. This review provided ideas and methods for subsequent researchers to develop rapid sintering methods for power electronic packaging.@en

Atrial fibrillation (AF) is the most prevalent cardiac arrhythmia, progressive in nature, and known to have a negative impact on mortality, morbidity, and quality of life. Patients requiring acute termination of AF to restore sinus rhythm are subjected to electrical cardioversion, which requires sedation and therefore hospitalization due to pain resulting from the electrical shocks. However, considering the progressive nature of AF and its detrimental effects, there is a clear need for acute out-of-hospital (i.e., ambulatory) cardioversion of AF. In the search for shock-free cardioversion methods to realize such ambulatory therapy, a method referred to as optogenetics has been put forward. Optogenetics enables optical control over the electrical activity of cardiomyocytes by targeted expression of light-activated ion channels or pumps and may therefore serve as a means for cardioversion. First proof-of-principle for such light-induced cardioversion came from in vitro studies, proving optogenetic AF termination to be very effective. Later, these results were confirmed in various rodent models of AF using different transgenes, illumination methods, and protocols, whereas computational studies in the human heart provided additional translational insight. Based on these results and fueled by recent advances in molecular biology, gene therapy, and optoelectronic engineering, a basis is now being formed to explore clinical translations of optoelectronic control of cardiac rhythm. In this review, we discuss the current literature regarding optogenetic cardioversion of AF to restore normal rhythm in a shock-free manner. Moreover, key translational steps will be discussed, both from a biological and technological point of view, to outline a path toward realizing acute shock-free ambulatory termination of AF.@en