GZ
G.Q. Zhang
662 records found
1
...
The heat produced within the device in its package depends on the power supplied to each IP block. The improper placement of an IP block with high power consumption can become a reliability risk for IC packages, as it can significantly affect the reliability of solder balls due t
...
Silicon-Carbide (SiC) MOSFETs are widely used in high-power and high-efficiency applications such as electric vehicles and power supplies. However, long-term reliability remains a critical concern, particularly under extreme operating conditions. This work aims to explain the hea
...
This Letter presents a combined analytical and experimental method to effectively decouple the radial and tangential residual stress fields induced by Berkovich nanoindentation in single-crystalline 4H-SiC using micro-Raman spectroscopy. By integrating the Raman stress characteri
...
With the miniaturization and high-power requirements of microelectronic devices, the current density carried by interconnects in packaging structures continually increases and reaches the threshold of electromigration (EM) failure. In this study, we investigated the microstructur
...
The 1.2 kV SiC VDMOSFETs with varied JFET width (LJFET) are designed and fabricated in this study. The static and dynamic characteristics of each design are measured and compared. There is the best trade-off performance in the design of LJFET = 1.8 μm according to FOM (BV2/Ron) a
...
Sintered materials have been widely applied, as an alternative to soldering, for power electronics packaging. One key issue for such die-attach material is to characterize the actual porosity, which is difficult to obtain through SEM cross-section analysis. Therefore, in this wor
...
Graphdiyne (GDY)/two-dimensional materials (2DMs) heterostructures present unique opportunities for advanced optoelectronic and neuromorphic devices because of their exceptional electrical, optical, and structural properties. However, the traditional methods for construction of G
...
This paper investigates the effects of three ageing factors (chemical, humidity, and temperature) and their interactions on the physical properties and degradation of silicone sealant used in microelectronic applications. The thermal degradation of silicone sealants was investiga
...
The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced electronics packaging. In this study, we explore the anisotropy in the microstructure and mechanical properties of sintered copper (Cu) NPs by combining experimental techniques with molec
...
The study focuses on the optical and electrical properties of Tungsten Ditelluride (WTe2), a type II Weyl semimetal, as well as the influence of its self-limiting oxide (SLO) layer that forms during natural oxidation. WTe2 exhibits promising applications in photodetection and ene
...
This article compares and evaluates the single pulse short-circuit robustness of silicon carbide (SiC) MOSFETs with linear and hexagonal cell topologies under different gate voltages, bus voltages, and case temperatures. The short-circuit failure mechanisms of the linear and hexa
...
Van der Waals heterojunctions (vdWHs) have garnered significant attention for their promising applications in optoelectronics, attributed to their exceptional physical attributes. In this study, we present a straightforward approach to fabricating high-performance vdWHs photodete
...
In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porou
...
This study presents a novel approach for localized silver (Ag) nanoparticles (NPs) sintering using microheater arrays embedded within the Si substrate. By applying controlled pulse currents, these microheaters generate targeted heat pulses, enabling rapid and localized sintering
...
Power electronics devices, pivotal in advancing electronic system technology, are essential for energy saving, enhancing power control efficiency, reducing noise, and minimizing size and volume. The evolution of power modules is based on innovative packaging structures, technolog
...
Corrosion protection is one of the most important issues when copper is applied in power electronics packaging as bonding wire, die attachment, interconnection, and DBC substrate. Covering a layer of corrosion-resistant encapsulation material is a worthy consideration to protect
...
As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to differen
...
Integrated circuits based on wide bandgap semiconductors are considered an attractive option for meeting the demand for high-temperature electronics. Here, we report an analog-to-digital converter fabricated in a silicon carbide complementary metal-oxide-semiconductor technology
...
Board level reliability can be of high interest for automotive electronic components when exposed to vibration-prone environments. However, the absence of an industry standard for board level vibration testing poses several challenges in establishing a well-characterized test set
...
Synchronized rectifiers offer promising solutions for piezoelectric energy harvesting; however, achieving the promised energy extraction performance necessitates using either a bulky inductor or multiple large capacitors, which cannot be on-chip integrated and increase the system
...