GZ
G.Q. Zhang
646 records found
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This paper compares and evaluates the single pulse short-circuit robustness of SiC MOSFETs with linear and hexagonal cell topologies under different gate voltages, bus voltages, and case temperatures. The short-circuit failure mechanisms of the linear and hexagonal cell topologie
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This paper investigates the effects of three ageing factors (chemical, humidity, and temperature) and their interactions on the physical properties and degradation of silicone sealant used in microelectronic applications. The thermal degradation of silicone sealants was investiga
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Van der Waals heterojunctions (vdWHs) have garnered significant attention for their promising applications in optoelectronics, attributed to their exceptional physical attributes. In this study, we present a straightforward approach to fabricating high-performance vdWHs photodete
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The study focuses on the optical and electrical properties of Tungsten Ditelluride (WTe2), a type II Weyl semimetal, as well as the influence of its self-limiting oxide (SLO) layer that forms during natural oxidation. WTe2 exhibits promising applications in photodetection and ene
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Effects of Current Filaments on IGBT Avalanche Robustness
A Simulation Study
With the increase in voltage level and current capacity of the insulated gate bipolar transistor (IGBT), the avalanche effect has become an important factor limiting the safe operating area (SOA) of the device. The hole injection into the p/n junction on the backside of the IGBT
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This report demonstrates an innovative method to achieve large scale 20 μm pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnection
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Wearable biosensors provide continuous, real-time physiological monitoring of biochemical markers in biofluids such as sweat, tears, saliva, and interstitial fluid. However, achieving high stretchability and stable biochemical signal monitoring remains challenging. Here, we propo
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Two P-Based depth of SiC VDMOSFETs (group A and B) are designed and manufactured by enhanced P-Based implantation. The group A with lower P-based depth has a better static properties, while group B has a higher high frequency switching performance. Further, the avalanche reliabil
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Power electronic modules have undergone a remarkable transition in terms of power density, temperature, and performance due to the shift from Si to WBG (Wide bandgap) semiconductors. WBG semiconductors with their high switching speed, high breakdown voltage and higher operation t
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The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modele
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4H-SiC is widely used in power electronics owing to its superior physical properties. However, temperature-induced stresses compromise the reliability of 4H-SiC power devices in high-temperature applications, warranting precise, and nondestructive stress characterization responsi
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During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo
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Power MOSFET dies in the automotive industry are becoming larger (>5 × 5 mm) and thinner (<50 µm) to meet high-performance and lifetime requirements. Ensuring the mechanical robustness of these large ultrathin chips is crucial for reliable electronic devices and high-throug
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With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sin
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Driven by the need for improved quality, energy efficiency, and visual innovation, display technology has evolved from CRT to Mini LED. However, the transfer process in Mini LED assembly poses challenges in precision. This study addressed the displacement issue during the transfe
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Corrigendum to “Insights into the high-sulphur aging of sintered silver nanoparticles
An experimental and ReaxFF study” [Corros. Sci. 192 (2021) 109846] (Corrosion Science (2021) 192, (S0010938X21006120), (10.1016/j.corsci.2021.109846))
The authors regret that in the above article the Fig. 3 contains an error of cross-section image of group C at 48 h on Page 4. Fig. 3 should read: This correction does not influence the method, results and conclusions of the original article. The authors would like to apologise f
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As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to differen
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From Short Circuit to Completed Circuit
Conductive Hydrogel Facilitating Oral Wound Healing
The primary challenges posed by oral mucosal diseases are their high incidence and the difficulty in managing symptoms. Inspired by the ability of bioelectricity to activate cells, accelerate metabolism, and enhance immunity, a conductive polyacrylamide/sodium alginate crosslinke
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Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical beha
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Tungsten disulfide (WS2) has recently attracted considerable attention owing to its excellent physical, chemical, electronic, and optical properties, leading to increased research into its applications in electronic and optoelectronic devices. However, the oxidation of 2D materia
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