JC

Junwei Chen

5 records found

This Letter presents a combined analytical and experimental method to effectively decouple the radial and tangential residual stress fields induced by Berkovich nanoindentation in single-crystalline 4H-SiC using micro-Raman spectroscopy. By integrating the Raman stress characteri ...
In harsh offshore environments, large-area sintered nano-copper (Cu) interconnections, which serve as die attachment material or thermal interface material (TIM), are prone to degradation from hydrogen sulfide (H2S) corrosion. This study introduced a film-forming technique based ...
Sintered nano-copper (Cu) improves the thermal performance of SiC MOSFET Fan-Out Panel-Level Packaging (FOPLP), a widely adopted method for miniaturizing electronic systems and modules. This study presented, for the first time, the prototyping and characterization of a 1.2 kV SiC ...
Power electronics devices, pivotal in advancing electronic system technology, are essential for energy saving, enhancing power control efficiency, reducing noise, and minimizing size and volume. The evolution of power modules is based on innovative packaging structures, technolog ...
With the rapid development of new energy vehicles and offshore wind power systems in coastal cities, the application scale of power devices is constantly increasing. However, the corrosion problem of power packaging interconnection materials caused by the humid air and chlorine-r ...