This Letter presents a combined analytical and experimental method to effectively decouple the radial and tangential residual stress fields induced by Berkovich nanoindentation in single-crystalline 4H-SiC using micro-Raman spectroscopy. By integrating the Raman stress characterization model with Yoffe’s expanding cavity model, precise extraction of individual residual stress components around the indentation region is realized. Through the vertical backscattering micro-Raman mapping of the E2 phonon mode, we systematically investigate the residual stress distribution near the indentation. The results highlight significant anisotropy in nanoindentation-induced stress fields, strongly dependent on the crystal orientation of 4H-SiC, predominantly featuring radial tensile stress gradients. This comprehensive theoretical–experimental approach offers a robust optical framework for residual stress characterization in 4H-SiC and provides foundational insights for extending Raman spectroscopy-based stress characterization to other crystalline materials and related device structures.

Power electronics devices, pivotal in advancing electronic system technology, are essential for energy saving, enhancing power control efficiency, reducing noise, and minimizing size and volume. The evolution of power modules is based on innovative packaging structures, technologies, and materials. This article provides a comprehensive review of inorganic nonmetallic packaging materials and technologies in power electronics packaging. It first analyzes the packaging structures and trends of power electronics. The article then discusses inorganic nonmetallic encapsulants such as cement and glass in detail. It also reviews traditional ceramic substrates and elaborates on the advantages of multilayer ceramic technologies, including low-temperature co-fired ceramics, as substrates, while looking forward to the commercialization of inorganic composite substrates such as SiCp/Al matrix composites and diamond. Subsequently, the article overviews inorganic nonmetallic fillers for thermal interface materials, emphasizing the application of two-dimensional materials such as graphene and boron nitride, and introduces inorganic nonmetallic phase change materials. Finally, it explores the application and future development trends of inorganic nonmetallic materials in embedded packaging technologies.