Enhanced hydrogen sulfide corrosion resistance of large-area sintered nano-copper for power electronics module using atmospheric pressure plasma jet treatment
Jiajie Fan (Fudan University, Research Institute of Fudan University, Ningbo, TU Delft - Electronic Components, Technology and Materials)
Wei Du (Fudan University)
Wei Chen (Fudan University)
Junwei Chen (Fudan University)
Chenshan Gao (Southern University of Science and Technology )
Liang Zhang (Changzhou Institute of Inspection Testing Standardization and Certification)
Xi Zhu (Fudan University, Research Institute of Fudan University, Ningbo)
Huaiyu Ye (Southern University of Science and Technology )
Chuan Chen (China National Electric Apparatus Research Institute Co., Ltd)
Guoqi Zhang (TU Delft - Electronic Components, Technology and Materials)
More Info
expand_more
Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.
Abstract
In harsh offshore environments, large-area sintered nano-copper (Cu) interconnections, which serve as die attachment material or thermal interface material (TIM), are prone to degradation from hydrogen sulfide (H2S) corrosion. This study introduced a film-forming technique based on atmospheric pressure plasma jet (APPJ) to improve the corrosion resistance of large-area sintered nanoCu joint. The corrosion protection mechanism against H2S-containing atmospheric corrosion was investigated using both experimental methods and density functional theory (DFT) simulations. The key findings were as follows: (1) The deposition film, primarily composed of a Si-O3 network, effectively protected sintered Cu plate from corrosion by H2S gas, and maintaining the mechanical performance of sintered Cu joint after 384 h of H2S testing. (2) The dissociation products of the APPJ-treated precursor hexamethyldisiloxane (HMDSO), −OSiCH3 and −OSi(CH3)3, formed stable chemical bonds on the sintered nanoCu surface, resulting in the formation of −OSiCH3(O-CH3)2 fragments. (3) The −OSiCH3(O-CH3)2 fragments were unreactive toward to corrosion agents such as H2S, O2, and H2O, and also serving as a barrier to block their access to the sintered nanoCu surface. This study provided a comprehensive understanding of the corrosion protection mechanism of sintered nanoCu using APPJ-deposited films, offering valuable insights for improving the reliability of power electronics.