With the rapid development of new energy vehicles and offshore wind power systems in coastal cities, the application scale of power devices is constantly increasing. However, the corrosion problem of power packaging interconnection materials caused by the humid air and chlorine-rich environment near the sea is gradually emerging. This study addresses the corrosion protection of sintered nano-copper by innovatively employing atmospheric pressure plasma jet (APPJ) technology with hexamethyldisiloxane (HMDSO) as precursor to construct organic-inorganic hybrid hydrophobic coatings on copper surfaces. Experimental results demonstrate that the coating exhibits a three-dimensional crosslinked Si-O network structure. The synergistic effect between surface micron-scale spherical clusters and methyl groups elevates the contact angle by 50 % to 153.1° Electrochemical characterization reveals that the coating positively shifts corrosion potential by 0.035 V and reduces corrosion current density from 6.008×10−7 A/cm2 to 5.542×10−7 A/cm2, while maintaining higher activation energy across the experimental temperature range (30–60℃). EIS tests show that the coating effectively increases the charge transfer impedance of the sample, indicating an improvement in corrosion resistance. The 168-hour immersion test confirms effective barrier against Cl−corrosive attack with preserved substrate integrity. Density functional theory (DFT) simulations elucidate that unsaturated methylated fragments in HMDSO preferentially graft onto copper surface via chemisorption, where strong interfacial bonding energies (-2.26 ∼ -4.38 eV) facilitate cleavage and crosslinking to form stable siloxane networks. This work proposes a novel anti-corrosion surface engineering strategy for copper interconnects, while revealing the plasma-induced interfacial bonding mechanisms of hybrid coatings, providing both theoretical and experimental foundations for developing durable electronic packaging materials.

High-energy Al ion implantation is an indispensable technique for achieving precise doping in fabricating 4H‑SiC devices. However, it inevitably introduces interfacial damage and residual stress that can compromise subsequent manufacturing processes and device reliability. Conventional destructive characterization techniques cannot provide real-time, in‑situ, nondestructive monitoring under process conditions, creating a major bottleneck in quality control. Here, we establish a predictive modeling framework that integrates multiscale simulations with advanced, non‑destructive micro‑Raman spectroscopy to systematically investigate the evolution of high-energy Al ion implantation–induced interface defects and residual stress in 4H-SiC. Simulation results reveal a linear relationship between the implantation dose and the formation of vacancies and interstitial defects, while the stress accumulation tends to saturate at higher doses due to a dynamic equilibrium among defect interactions. Complementary micro‐Raman spectroscopy corroborates the simulations, showing that the damaged interface layer deepens from approximately 300 nm at a dose of 1014 ions cm−2 to nearly 500 nm at 1016 ions cm−2, consistent with Monte Carlo predictions. Furthermore, the molecular dynamics simulations capture a trend of the implantation stress evolution with strong concurrence with the Raman-measured residual stress. This combined computational–experimental approach elucidates the fundamental mechanisms governing defect formation and residual stress in ion‑implanted 4H‑SiC, establishes implantation dose as the pivotal role of 4H-SiC in defect density and residual stress, and underscores the utility of optical‑based characterization in real‑time, non‑invasive quality control for advanced manufacturing.