The 1.2 kV SiC VDMOSFETs with varied JFET width (LJFET) are designed and fabricated in this study. The static and dynamic characteristics of each design are measured and compared. There is the best trade-off performance in the design of LJFET = 1.8 μm according to FOM (BV2/Ron) and FOM (Ciss/Crss). Besides, the surge capacity and evaluation for series designs are investigated under conditions of Vgs = 0 V and Vgs = −5 V. There is a best surge capacity in design of LJFET=1.2 μm, and the largest surge energy is the design of LJFET=2.0 μm. Further, the surge failure mechanisms of LJFET = 1.2 μm, 1.8 μm, and 2.0 μm under condition of Vgs = −5 V are investigated by decapsulated and FIB. Besides, the TCAD simulation was employed to theoretical analysis. The results show that the extremely high temperature was generated instantaneously under surge condition, resulting in epoxy carbonization, polysilicon melting and ILD oxide crack in failed position. Besides, the surge dissipating energy causes an instantaneous high temperature on the entire chip, resulting in aluminum remetallization. This paper would provide suggestions for device design and surge study.

Two P-Based depth of SiC VDMOSFETs (group A and B) are designed and manufactured by enhanced P-Based implantation. The group A with lower P-based depth has a better static properties, while group B has a higher high frequency switching performance. Further, the avalanche reliability and failure mechanism for two groups are investigated by UIS experiment and TCAD simulation. The results show that the high temperature is generated by energy dissipation during avalanche and it drives the parasitic BJT conduction, causing Ids out of control and instantaneous heat concentration in a very short time. Significantly, high P-Based depth exhibits higher UIS reliability due to smaller Rb and more difficult to active parasitic BJT.

Using TCAD simulations, the silicon carbide metal-oxide-semiconductor field-effect transistor with p-type floating islands (SiC FLIMOSFET) is systematically investigated in this paper. The doping concentration (N _FLI ), length (L), and position (D1) of floating islands are optimized according to breakdown voltage (BV), electric field distribution, and on-resistance. The results show that NFLI = 1 × 10 ¹⁷ cm ^-3 , L = 2.5 μm, and D1 = 9.0 μm are superior values for FLI structure considering tradeoff between BV and on-resistance. With the same BV capacity, the on-resistance of SiC FLIMOSFET is decrease by 32% comparing to the conventional SiC VDMOSFET. Besides, the dynamic property shows 16.5% reduction of FoM R _{on} cdot Q _GD in the SiC FLIMOSFET. Significantly, comparing to the conventional structure, the electro-thermal simulation indicates that the SiC FLIMOSFET has a higher robustness under short-circuit condition owing to the reduction of thermal stress in SiC/SiO ₂ interface. All the results show that the SiC FLIMOSFET has a good potential in SiC power device.

In this study, the structural, electronic and optical properties of a tungsten disulfide (WS₂) hybrid with indium-gallium-zinc-oxide (IGZO) heterostructures were investigated based on density functional theory (DFT) calculations. According to the results of binding energy, charge density difference and electron localization function of heterostructures, we found that the WS₂ and IGZO monolayers were bound to each other via non-covalent interactions with large binding energy. The calculated results illustrate that the AAii stacking pattern has an indirect band gap of 1.643 eV, while AAi and AB stacking patterns have maximum direct-gaps of 1.102 eV and 1.234 eV, respectively. Under an external E-field and mechanical strain, the response of the energy gap of the WS₂/IGZO heterostructure monotonically decreased over a wide range, even with a semiconductor-metal transition. In addition, we investigated the optical properties of the heterostructure and found that it exhibits a much broad spectral responsivity (from visible light to deep UV light) and a more pronounced optical absorption than WS₂ and IGZO monolayers. Moreover, the tensile strain could weaken the photoresponse of the heterostructure to the UV light and enhance the response for the visible light; under compressive strain, the heterostructure showed a strong absorption peak in the UV light. Meanwhile, a red-shift was observed under an external strain. All these unique and tunable properties indicate that the WS₂/IGZO heterostructure is a good candidate for nanoelectronic and photoelectronic devices, such as field-effect transistors, flexible sensors, photodetectors and photonic devices.