OB

Olof Bäcke

3 records found

This study investigates the interface strength and fracture behavior of sintered copper (Cu) nanoparticles (NPs) for all-Cu integration in advanced microelectronics packaging. Micro-cantilever bending tests on three configurations (Cu NP-notched, interface-notched and un-notched ...
The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced electronics packaging. In this study, we explore the anisotropy in the microstructure and mechanical properties of sintered copper (Cu) NPs by combining experimental techniques with molec ...
As the dimensions of interconnects in integrated circuits continue to shrink, an urgent need arises to understand the physical mechanism associated with electromigration. Using x-ray nanodiffraction, we analyzed the stresses in Blech-structured pure Cu lines subjected to differen ...