SD
Sander Dorrestein
Authored
1 records found
Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spre
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Contributed
1 records found
Design of a novel thermocompression bonding module
For high throughput Flex-on-Substrate assembly
Flex-on-substrate assembly is an increasingly popular electronics assembly type that is based on thermocompression bonding: a combination of high temperature and pressure. Currently, up to two-thirds of the cycle time is spent on heating and cooling. To meet the growing demand fo
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