This study presents a novel approach for localized silver (Ag) nanoparticles (NPs) sintering using microheater arrays embedded within the Si substrate. By applying controlled pulse currents, these microheaters generate targeted heat pulses, enabling rapid and localized sintering while maintaining the surrounding device components at room temperature. This localized heating minimizes thermal stress caused by thermal expansion mismatches, as sintering completes within milliseconds. Compared to conventional sintering techniques, this method improves process efficiency, reduces power consumption, and provides precise spatial control over the sintered regions. The proposed approach offers a promising alternative for microelectronics packaging and integration, particularly in applications requiring precise thermal management.