This study presents a novel approach for localized silver (Ag) nanoparticles (NPs) sintering using microheater arrays embedded within the Si substrate. By applying controlled pulse currents, these microheaters generate targeted heat pulses, enabling rapid and localized sintering while maintaining the surrounding device components at room temperature. This localized heating minimizes thermal stress caused by thermal expansion mismatches, as sintering completes within milliseconds. Compared to conventional sintering techniques, this method improves process efficiency, reduces power consumption, and provides precise spatial control over the sintered regions. The proposed approach offers a promising alternative for microelectronics packaging and integration, particularly in applications requiring precise thermal management.

This study presents a new design for localized metallic sintering using microheaters on a glass substrate. By applying controlled pulse currents, the microheaters generate focused heat pulses that enable rapid, localized sintering while keeping nearby device components at room temperature. This approach reduces thermal stress caused by thermal expansion mismatches, as sintering is completed within seconds. Compared to conventional techniques, it improves efficiency, lowers power consumption, and provides precise control over the sintered areas. This method offers a promising alternative for microelectronics packaging and integration, particularly in applications requiring careful thermal management. The microheaters are also successfully fabricated for later experimental validation of this novel design.