Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers

Conference Paper (2025)
Author(s)

X. Hu (TU Delft - Electronic Components, Technology and Materials, Ampleon)

J. Huang (Ampleon, TU Delft - Electronic Components, Technology and Materials)

R.H. Poelma (TU Delft - Electronic Components, Technology and Materials, Nexperia B.V.)

Hans van Rijckevorsel (Ampleon)

Willem van Driel (TU Delft - Electronic Components, Technology and Materials)

G. Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/EuroSimE65125.2025.11006605
More Info
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Publication Year
2025
Language
English
Research Group
Electronic Components, Technology and Materials
Bibliographical Note
Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.@en
ISBN (electronic)
9798350393002
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Abstract

In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porous network. These models are coupled via a hybrid free energy function to achieve a realistic representation of the microstructure evolution. This study further extends the hybrid model by incorporating (a) a flexible exchange interaction matrix to model the crystal anisotropy in grain growth, (b) Glauber or Kawasaki dynamics to describe different diffusion mechanisms, and (c) the effect of pinning sites, representing impurity-driven grain boundary stabilization. The computational framework is implemented using Taichi Lang, which allows for efficient parallel simulations. Results show that the model effectively captures the long-term evolution of the sintered silver microstructure in good agreement with experimental observations. This hybrid model is a powerful tool to predict microstructural reliability of sintered silver die attach layers, supporting material design and process optimization for high-power electronic applications.

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