An Outlook on Power Electronics Reliability and Reliability Monitoring
H.A. Martin (TU Delft - Electronic Components, Technology and Materials, Chip Integration Technology Center (CITC))
Edsger C.P. Smits (Chip Integration Technology Center (CITC))
R.H. Poelma (Nexperia B.V., TU Delft - Electronic Components, Technology and Materials)
Willem van Driel (TU Delft - Electronic Components, Technology and Materials, Signify)
G. Zhang (TU Delft - Electronic Components, Technology and Materials)
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Abstract
The increasing awareness of environmental concerns and sustainability underlines the importance of energy-efficient systems, renewable energy technologies, electric vehicles, and smart grids. Hence, stringent constraints and safety regulations have been prompted to meet reliability standards in power electronics. This chapter provides a comprehensive outlook on the current state of power semiconductor devices, field-critical applications, dominant degradation mechanism (chip-related and package-related), and the emerging measurement techniques for reliability/condition monitoring. This chapter delves into the underlying physics behind each reliability measurement method reviewed. A comparative summary of cost, complexity, online monitoring capability, accuracy, and intrusiveness is provided to enable readers to make informed decisions about the measurement methods. This chapter emphasizes the significance of early fault detection through online monitoring, as it can effectively reduce system downtime for seamless non-interruptive operation.