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JT
J. Tang
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Academic Work (9)
Conference paper (7)
Doctoral thesis (1)
Journal article (1)
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9 records found
1
MIP plasma decapsulation of copper¿wired semiconductor devices for failure analysis
Doctoral thesis (2014) -
J. Tang (author)
,
C.I.M. Beenakker (supervisor)
Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Conference paper (2013) -
J. Tang (author)
,
CH Chen (author)
,
SK Liang (author)
,
EGJ Reinders (author)
,
CTA Revenberg (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
Journal article (2012) -
J. Tang (author)
,
D Gruber (author)
,
JBJ Schelen (author)
,
H-J Funke (author)
,
C.I.M. Beenakker (author)
Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma
Conference paper (2012) -
J. Tang (author)
,
EGJ Reinders (author)
,
CTA Revenberg (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer
Conference paper (2012) -
J. Tang (author)
,
C.I.M. Beenakker (author)
,
JBJ Schelen (author)
Flexible system for real-time plasma decapsulation of copper wire bonded ic packages
Conference paper (2012) -
J. Tang (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
Conference paper (2011) -
J. Tang (author)
,
H. Ye (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
Plasma etching for failure analysis of integrated circuit packages
Conference paper (2011) -
J. Tang (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging
Conference paper (2010) -
J. Tang (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)