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JT
J. Tang
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Authored
9 records found
Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging
Conference paper -
J. Tang
,
JBJ Schelen
,
C.I.M. Beenakker
Plasma etching for failure analysis of integrated circuit packages
Conference paper -
J. Tang
,
JBJ Schelen
,
C.I.M. Beenakker
Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis
Conference paper -
J. Tang
,
H. Ye
,
JBJ Schelen
,
C.I.M. Beenakker
MIP plasma decapsulation of copper¿wired semiconductor devices for failure analysis
Doctoral thesis -
J. Tang
Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation
Journal article -
J. Tang
,
D Gruber
,
JBJ Schelen
,
H-J Funke
,
C.I.M. Beenakker
Flexible system for real-time plasma decapsulation of copper wire bonded ic packages
Conference paper -
J. Tang
,
JBJ Schelen
,
C.I.M. Beenakker
Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma
Conference paper -
J. Tang
,
EGJ Reinders
,
CTA Revenberg
,
JBJ Schelen
,
C.I.M. Beenakker
Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Conference paper -
J. Tang
,
CH Chen
,
SK Liang
,
EGJ Reinders
,
CTA Revenberg
,
JBJ Schelen
,
C.I.M. Beenakker
Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer
Conference paper -
J. Tang
,
C.I.M. Beenakker
,
JBJ Schelen