Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Fast etching of molding compound by an Ar/O2/CF4 plasma and process improvements for semiconductor package decapsulation

Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Flexible system for real-time plasma decapsulation of copper wire bonded ic packages

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Plasma etching for failure analysis of integrated circuit packages

Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

Optimization of the microwave induces plasma system for failure analysis in integrated circuit packaging