A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.