K
K.
info
Please Note
<p>This page displays the records of the person named above and is not linked to a unique person identifier. This record may need to be merged to a profile.</p>
1 records found
1
Authored
One of the key challenges in 3D Stacked-ICs (3D-SIC) is to guarantee high product quality at minimal cost. Quality is mostly determined by the applied tests and cost trade-offs. Testing 3D-SICs is very challenging due to several additional test moments for the mid-bond stacks, i.
...