Circular Image

M. Husain

info

Please Note

3 records found

Conference paper (2025) - S. Biswas, M. Husain, S. Vollebregt
In this work, we report a simple, scalable, and dry fabrication technique for realizing thin-film platinum resistance temperature detectors (RTDs), utilizing spark ablation technology. Pure spark-ablated platinum nanoparticles, with an average diameter of around 2.2 nm, were directly deposited through chemical-free impaction printing onto the substrate, enabling direct sensor patterning without complex processing steps. Experimental investigations revealed that higher deposition speeds produce sparser and thermally unstable films, with 1 mm/min identified as the optimal printing rate. Additionally, it was established that the film temperature coefficient of resistance (TCR) improves with increasing layer thickness, achieving a maximum mean TCR of 2.17 × 10−3°C−1 for an 8-layer RTD. The printed Pt sensor demonstrated linear temperature-resistance characteristics while maintaining high stability and repeatability over multiple thermal cycles, spanning 25–200 °C. This study lays the groundwork for advancing practical and cost-effective printed thermal sensing technologies. ...
Conference paper (2025) - Mudassir Husain, Leandro N. Sacco, Nigel Rising, Elias Torres, Sten Vollebregt
This work reports, for the first time, the use of spark ablation with impaction printing to selectively deposit silver (Ag) and gold (Au) nanoparticle (NP) functionalization on single-layer graphene (SLG) based gas sensors. This method avoids lithography and chemical processes, maintaining the device's quality while potentially lowering the fabrication costs. Ag-decorated sensors reveal a three-fold improvement in nitrogen dioxide (NO2) gas response over pristine-SLG sensors. We demonstrate detection capabilities down to 50 ppb at room temperature, negating the requirement for external thermal or photoactivation. In contrast to pristine or Au-decorated SLG sensors, Ag-decorated devices exhibit 96% recovery at room temperature (RT). These results highlight the potential of using spark ablation with impaction printing for functionalizing graphene-based sensors. ...
Conference paper (2024) - Tiance An, Mudassir Husain, Sten Vollebregt
Packaging is an indispensable part in microelectronics manufacturing industry, where transfer molding as an essential step is typically included for encapsulation. Recently, with the fruitful achievements of research on graphene in gas sensing, there is also urgent need for study on how the packaging process will affect the graphene, to develop compatible manufacture protocol for practical graphene-based gas sensor. In this work, we carried out experiments on how molding compound outgassing affects graphene for gas sensing. Our results show that although there is some impact on the electrical properties of the graphene, there is no change in the microstructure, and only a slight and manageable change in gas sensing abilities. This work suggests that graphene could maintain performances after epoxy molding packaging processes. ...