Aims. Future astrophysics and cosmic microwave background space missions operating in the far-infrared to millimetre part of the spectrum will require very large arrays of ultra-sensitive detectors in combination with high multiplexing factors and efficient low-noise and low-power readout systems. We have developed a demonstrator system suitable for such applications. Methods. The system combines a 961 pixel imaging array based upon Microwave Kinetic Inductance Detectors (MKIDs) with a readout system capable of reading out all pixels simultaneously with only one readout cable pair and a single cryogenic amplifier. We evaluate, in a representative environment, the system performance in terms of sensitivity, dynamic range, optical efficiency, cosmic ray rejection, pixel-pixel crosstalk and overall yield at an observation centre frequency of 850 GHz and 20% fractional bandwidth. Results. The overall system has an excellent sensitivity, with an average detector sensitivity (NEPdet) =3 × 10-19 W/Hz measured using a thermal calibration source. At a loading power per pixel of 50 fW we demonstrate white, photon noise limited detector noise down to 300 mHz. The dynamic range would allow the detection of ~1 Jy bright sources within the field of view without tuning the readout of the detectors. The expected dead time due to cosmic ray interactions, when operated in an L2 or a similar far-Earth orbit, is found to be <4%. Additionally, the achieved pixel yield is 83% and the crosstalk between the pixels is <-30 dB. Conclusions. This demonstrates that MKID technology can provide multiplexing ratios on the order of a 1000 with state-of-the-art single pixel performance, and that the technology is now mature enough to be considered for future space based observatories and experiments.@en

We present a fabrication method for sub-micron lens-coupled lumped element kinetic inductance detectors (LEKIDs) for broadband sub-millimeter (sub-mm) and THz radiation detection. The LEKIDs are fabricated from very thin (12 nm) and narrow (200 nm) aluminum lines to match the impedance of the LEKID to the substrate impedance. The fabrication process is based on a combination of maskless laserwriter lithography and electron beam lithography, providing low (few microns) and high resolution (down to 200 nm) over large areas in a single process. Preliminary optical characterization shows that the fabricated LEKIDs are sensitive to 1.5 THz radiation.@en