Compliant micromechanisms (CMMs) acquire mobility from the deflection of elastic members and have been proven to be robust by millions of silicon MEMS devices. However, the limited deflection of silicon impedes the realization of more sophisticated CMMs, which often require larger deflections. Recently, some novel manufacturing processes have emerged but are not well known by the community. In this paper, the realization of CMMs is reviewed, aiming to provide help to mechanical designers to quickly find the proper realization method for their CMM designs. To this end, the literature surveyed was classified and statistically analyzed, and representative processes were summarized individually to reflect the state of the art of CMM manufacturing. Furthermore, the features of each process were collected into tables to facilitate the reference of readers, and the guidelines for process selection were discussed. The review results indicate that, even though the silicon process remains dominant, great progress has been made in the development of polymer-related and composite-related processes, such as micromolding, SU-8 process, laser ablation, 3D printing, and the CNT frameworking. These processes result in constituent materials with a lower Young’s modulus and larger maximum allowable strain than silicon, and therefore allow larger deflection. The geometrical capabilities (e.g., aspect ratio) of the realization methods should also be considered, because different types of CMMs have different requirements. We conclude that the SU-8 process, 3D printing, and carbon nanotube frameworking will play more important roles in the future owing to their excellent comprehensive capabilities.

A novel microelectromechanical system (MEMS) magnetic sensor based on fiber-optic detection is presented in this paper. The magnetic field is detected by measuring the tilting motion of a mechanical suspension with permanent magnet attached. When the magnet is magnetized in different directions, the magnetic sensor can detect the in-plane or out-of-plane magnetic field. The MEMS structure was designed analytically, fabricated by using a bulk micromachining process, and assembled with the permanent magnet manually. Finally, the magnetic-sensing capability of an as-prepared sensor was tested by assembling it into the fiber-optic detection system. The testing result shows a sensitivity of 2.86 mV/μT for the in-plane magnetic field and 6.57 mV/μT for the out-of-plane. According to the mechanical-thermal noise theory, estimated resolutions are, respectively, close to 142 and 62 nT for the in-plane and out-of-plane magnetic field, which suggest the adequacy for measurement in earth magnetic field range. The reported magnetic sensor shows the capability to fulfill the high-resolution detection of low-frequency signals, benefitted from the utilization of permanent magnet and fiber-optic detection. Moreover, the sensitive direction of reported magnetic sensor can be easily switched by varying its magnetized direction, which, therefore, paves the way to the integrated tri-axis magnetic sensor.