LL
L. La Spina
Authored
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Substrate transfer
Thermal resistance
Heatspreaders
Thermal instability
Silicon-on-glass technology
Varactors
Adaptive circuits
Aluminum nitride deposition
Bipolar junction transistors (BJTs)
Complementary bipolar silicon technology
Heterojunction bipolar transistors (HBTs)
Microwave devices
Radio frequency (RF) circuits
Schottky collector contacting
Selfheating
Thin-film heatspreaders
Two-sided contacting
Wireless systems
This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission line
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