In this study, high-performance few-layered ReS₂ field-effect transistors (FETs), fabricated with hexagonal boron nitride (h-BN) as top/bottom dual gate dielectrics, are presented. The performance of h-BN dual gated ReS₂ FET having a trade-off of performance parameters is optimized using a compact model from analytical choice maps, which consists of three regions with different electrical characteristics. The bottom h-BN dielectric has almost no defects and provides a physical distance between the traps in the SiO₂ and the carriers in the ReS₂ channel. Using a compact analyzing model and structural advantages, an excellent and optimized performance is introduced consisting of h-BN dual-gated ReS₂ with a high mobility of 46.1 cm² V⁻¹ s⁻¹, a high current on/off ratio of ≈10⁶, a subthreshold swing of 2.7 V dec⁻¹, and a low effective interface trap density (N_t,eff) of 7.85 × 10¹⁰ cm⁻² eV⁻¹ at a small operating voltage (<3 V). These phenomena are demonstrated through not only a fundamental current–voltage analysis, but also technology computer aided design simulations, time-dependent current, and low-frequency noise analysis. In addition, a simple method is introduced to extract the interlayer resistance of ReS₂ channel through Y-function method as a function of constant top gate bias.