MT
M. Tripathi
2 records found
1
Master thesis
(2022)
-
M.
Tripathi
(author),
Y.
Gonzalez-Garcia
(mentor),
Yaiza
Gonzalez-Garcia
(mentor),
Y.
Gonzalez Garcia
(mentor),
Yaiza Gonzalez
Garcia
(mentor),
Yaiza
Gonzalez Garcia
(mentor),
Yaiza
Garcia
(mentor),
Y
Gonzalez-Garcia
(mentor),
Y
Gonzalez Garcia
(mentor),
Yaiza Gonzalez
Gonzalez Garcia
(mentor),
Y.
Garcia
(mentor),
Yaiza Gonzalez
Gonzalez-Garcia
(mentor),
Y
Garcia
(mentor),
S.
Asperti
(graduation committee member),
Simone
Asperti
(graduation committee member),
P.
Taheri
(coach),
Peyman
Taheri
(coach)
Excess CO2 in the atmosphere has been a troublesome problem for humanity for the last few decades now. Academics, governments and industries are working together to tackle this problem to avert a global warming disaster. Research on many technologies is in progress to tackle glob
...
Excess CO2 in the atmosphere has been a troublesome problem for humanity for the last few decades now. Academics, governments and industries are working together to tackle this problem to avert a global warming disaster. Research on many technologies is in progress to tackle global warming, with carbon capture being one exciting solution. The process of converting this captured carbon dioxide into something useful has gained momentum in research and academia since the 1980s. Out of the many catalysts worked upon to convert the excess CO2, copper has gained particular limelight because of its exceptional ability to reduce CO2 into valuable products such as methane, formic acid, ethane, methanol, to name a few.
The literature study associated with this project identified a knowledge gap between the present literature and the understanding of the microstructural impact on CO2 reduction. The thesis project studied the effect of microstructure changes on the electrochemical properties of copper and its subsequent impact on CO2 reduction capabilities to bridge the knowledge gap. Sigma- Aldrich copper of purity 99.999% was selected for this thesis work, and four samples: as received, electropolished, and two annealed samples were prepared. Optical microscopy and XRD measurements were used for microstructural characterization, and it was found that annealed samples lost their rolling direction, and their grain sizes increased. Evaluation of electrochemical behaviour through CV and EIS results indicated the formation of a complex triple passivation layer on the copper samples. Through evaluation of EIS results, we found that the electropolished sample had the most robust Cu2O layer.
From the CO2 reduction experiments, it was found that as-received samples had the highest F.E. for CO2 reduction, and non-electropolished samples had a high F.E. for hydrogen production. The performance of the electropolished sample stood out with a high F.E. of 46.3% for hydrocarbon production. The reason for this behaviour was, possibly, the presence of robust Cu2O layers that prevented the sample from catalyst poisoning and helped form a strong bond with CO* (carbon monoxide free radical).
The thesis opened up avenues for further research. By further investigation of factors like grain orientation and grain boundary density combined with XPS results, the understanding of the complex nature of passive layers formed on copper during CO2 reduction can be improved, which will ultimately help develop better catalysts.
The literature study associated with this project identified a knowledge gap between the present literature and the understanding of the microstructural impact on CO2 reduction. The thesis project studied the effect of microstructure changes on the electrochemical properties of copper and its subsequent impact on CO2 reduction capabilities to bridge the knowledge gap. Sigma- Aldrich copper of purity 99.999% was selected for this thesis work, and four samples: as received, electropolished, and two annealed samples were prepared. Optical microscopy and XRD measurements were used for microstructural characterization, and it was found that annealed samples lost their rolling direction, and their grain sizes increased. Evaluation of electrochemical behaviour through CV and EIS results indicated the formation of a complex triple passivation layer on the copper samples. Through evaluation of EIS results, we found that the electropolished sample had the most robust Cu2O layer.
From the CO2 reduction experiments, it was found that as-received samples had the highest F.E. for CO2 reduction, and non-electropolished samples had a high F.E. for hydrogen production. The performance of the electropolished sample stood out with a high F.E. of 46.3% for hydrocarbon production. The reason for this behaviour was, possibly, the presence of robust Cu2O layers that prevented the sample from catalyst poisoning and helped form a strong bond with CO* (carbon monoxide free radical).
The thesis opened up avenues for further research. By further investigation of factors like grain orientation and grain boundary density combined with XPS results, the understanding of the complex nature of passive layers formed on copper during CO2 reduction can be improved, which will ultimately help develop better catalysts.
Journal article
(2010)
-
B.C.
Arnold
(author),
B.C.
Arnold
(author),
G
Chen
(author),
G
Chen
(author),
G.
Kim
(author),
G.
Kim
(author),
D.
Kong
(author),
D.
Kong
(author),
H.
Park
(author),
H.
Park
(author),
D.
Son
(author),
D.
Son
(author),
S.
Song
(author),
S.
Song
(author),
S.
Jung
(author),
S.
Jung
(author),
B.C.
Hong
(author),
B.C.
Hong
(author),
H.
Kim
(author),
H.
Kim
(author),
J.H.
Kim
(author),
J.H.
Kim
(author),
K.S.
Lee
(author),
K.S.
Lee
(author),
H
Chen
(author),
H
Chen
(author),
H
Chen
(author),
H
Chen
(author),
H. N. R.
Chen
(author),
H. N. R.
Chen
(author),
H. N. R.
Chen
(author),
H. N. R.
Chen
(author),
S.
Park
(author),
S.
Park
(author),
J.
Kim
(author),
J.
Kim
(author),
M.
Choi
(author),
M.
Choi
(author),
G.
Hahn
(author),
G.
Hahn
(author),
S.
Choi
(author),
S.
Choi
(author),
YH
Choi
(author),
YH
Choi
(author),
J.L.
Goh
(author),
J.L.
Goh
(author),
H.
Jeong
(author),
H.
Jeong
(author),
T.
Kim
(author),
T.
Kim
(author),
J
Lee
(author),
J
Lee
(author),
Chengpeng
Jiang
(author),
Chengpeng
Jiang
(author),
C.
Jiang
(author),
C.
Jiang
(author),
Chenpeng
Jiang
(author),
Chenpeng
Jiang
(author),
S
Lee
(author),
S
Lee
(author),
P.I.
Petrov
(author),
P.I.
Petrov
(author),
J.
Williams
(author),
J.
Williams
(author),
M.
Ahmad
(author),
M.
Ahmad
(author),
M.
Ahmad
(author),
I.
Ahmed
(author),
I.
Ahmed
(author),
I.
Ahmed
(author),
M.S.
Asghar
(author),
M.S.
Asghar
(author),
M.S.
Asghar
(author),
M.A.A.
Awan
(author),
M.A.A.
Awan
(author),
M.A.A.
Awan
(author),
I.
Hussain
(author),
I.
Hussain
(author),
I.
Hussain
(author),
M.W.
Khan
(author),
M.W.
Khan
(author),
M.W.
Khan
(author),
S.
Muhammad
(author),
S.
Muhammad
(author),
S.
Muhammad
(author),
D.
Liang
(author),
D.
Liang
(author),
Haris
Shahzad
(author),
Haris
Shahzad
(author),
Haris
Shahzad
(author),
H.
Shahzad
(author),
H.
Shahzad
(author),
H.
Shahzad
(author),
P.M.
Zalewski
(author),
P.M.
Zalewski
(author),
A.E.
David
(author),
A.E.
David
(author),
P
Ribeiro
(author),
P
Ribeiro
(author),
P
Ribeiro
(author),
P
Ribeiro
(author),
PGR
Silva
(author),
PGR
Silva
(author),
M.
Finger
(author),
M.
Finger
(author),
M
Finger
(author),
M
Finger
(author),
M
Finger
(author),
M
Finger
(author),
M.
Finger
(author),
M.
Finger
(author),
A.
Denisov
(author),
A.
Denisov
(author),
V.
Kim
(author),
V.
Kim
(author),
A.
Anisimov
(author),
A.
Anisimov
(author),
Andrei G.
Anisimov
(author),
Andrei G.
Anisimov
(author),
A. G.
Anisimov
(author),
A. G.
Anisimov
(author),
B.
Liu
(author),
B.
Liu
(author),
A.J.
Levine
(author),
A.J.
Levine
(author),
V.
Petrov
(author),
V.
Petrov
(author),
M.
Daniël
(author),
M.
Daniël
(author),
J.I.
Hernandez
(author),
J.I.
Hernandez
(author),
J.I.
Hernández
(author),
J.I.
Hernández
(author),
Jose Ignacio
Hernández
(author),
Jose Ignacio
Hernández
(author),
Jose Ignacio
Hernandez
(author),
Jose Ignacio
Hernandez
(author),
José Ignacio
Hernandez
(author),
José Ignacio
Hernandez
(author),
José Ignacio
Hernández
(author),
José Ignacio
Hernández
(author),
B.
Gómez
(author),
B.
Gómez
(author),
J.
Bos
(author),
J.
Bos
(author),
D.
Campi
(author),
D.
Campi
(author),
M.
Hansen
(author),
M.
Hansen
(author),
J.
Harvey
(author),
J.
Harvey
(author),
H.
Hoffmann
(author),
H.
Hoffmann
(author),
X
Meng
(author),
X
Meng
(author),
R.A.
Loos
(author),
R.A.
Loos
(author),
F.E.
Meijers
(author),
F.E.
Meijers
(author),
M.
Mulders
(author),
M.
Mulders
(author),
L.
Orsini
(author),
L.
Orsini
(author),
E
Perez
(author),
E
Perez
(author),
A.
Sharma
(author),
A.
Sharma
(author),
S.
König
(author),
S.
König
(author),
F.A.
Meier
(author),
F.A.
Meier
(author),
Z.
Chen
(author),
Z.
Chen
(author),
A.J.H.
Herve
(author),
A.J.H.
Herve
(author),
J.
Tao
(author),
J.
Tao
(author),
A.
Sanchez
(author),
A.
Sanchez
(author),
M.
Weber
(author),
M.
Weber
(author),
A.
Schmidt
(author),
A.
Schmidt
(author),
Y.
Chang
(author),
Y.
Chang
(author),
E.
Enshan
(author),
E.
Enshan
(author),
E.
Chen
(author),
E.
Chen
(author),
Chen
Chen
(author),
Chen
Chen
(author),
Chen
Enshan
(author),
Chen
Enshan
(author),
W.
Chen
(author),
W.
Chen
(author),
A.C.S.
Go
(author),
A.C.S.
Go
(author),
C.
Kuo
(author),
C.
Kuo
(author),
S
Li
(author),
S
Li
(author),
W
Lin
(author),
W
Lin
(author),
J
Wang
(author),
J
Wang
(author),
P.L.T.
Chang
(author),
P.L.T.
Chang
(author),
Y.
Chao
(author),
Y.
Chao
(author),
K.
Chen
(author),
K.
Chen
(author),
Y.
LEI
(author),
Y.
LEI
(author),
Shu
Lin
(author),
Shu
Lin
(author),
S.
Lin
(author),
S.
Lin
(author),
R.
Lu
(author),
R.
Lu
(author),
J
Schumann
(author),
J
Schumann
(author),
C.C.
Wang
(author),
C.C.
Wang
(author),
Charlie C.L.
Wang
(author),
Charlie C.L.
Wang
(author),
Charlie
Wang
(author),
Charlie
Wang
(author),
M.
Wang
(author),
M.
Wang
(author),
M.
Kaya
(author),
M.
Kaya
(author),
M.
Kaya
(author),
M.
Kaya
(author),
Mesut
Kaya
(author),
Mesut
Kaya
(author),
Mesut
Kaya
(author),
Mesut
Kaya
(author),
Z
Wang
(author),
Z
Wang
(author),
M.O.
Kaya
(author),
M.O.
Kaya
(author),
M.O.
Kaya
(author),
M.O.
Kaya
(author),
N.O.
Sonmez
(author),
N.O.
Sonmez
(author),
N.O.
Sonmez
(author),
N.O.
Sonmez
(author),
T.O.C.
Cheng
(author),
T.O.C.
Cheng
(author),
M.
Hansen
(author),
M.
Hansen
(author),
RR
Brown
(author),
RR
Brown
(author),
J.
Williams
(author),
J.
Williams
(author),
J.P.
Hays
(author),
J.P.
Hays
(author),
A.
Papageorgiou
(author),
A.
Papageorgiou
(author),
A.P.D.
Rose
(author),
A.P.D.
Rose
(author),
A.
khan
(author),
A.
khan
(author),
Z.
Xue
(author),
Z.
Xue
(author),
R.E.
Taylor
(author),
R.E.
Taylor
(author),
J.
Rohlf
(author),
J.
Rohlf
(author),
S
Wu
(author),
S
Wu
(author),
S.
Bhattacharya
(author),
S.
Bhattacharya
(author),
D.V.Q.
Nguyen
(author),
D.V.Q.
Nguyen
(author),
P.
Cox
(author),
P.
Cox
(author),
H
Liu
(author),
H
Liu
(author),
M.
Nikolic
(author),
M.
Nikolic
(author),
J.N.V.
Smith
(author),
J.N.V.
Smith
(author),
M.
Tripathi
(author),
M.
Tripathi
(author),
S.
Schmid
(author),
S.
Schmid
(author),
Sonja
Schmid
(author),
Sonja
Schmid
(author),
Z.
Zhang
(author),
Z.
Zhang
(author),
J.H.C.
Hauser
(author),
J.H.C.
Hauser
(author),
X.
Yang
(author),
X.
Yang
(author),
A.
Chandra
(author),
A.
Chandra
(author),
F.
Liu
(author),
F.
Liu
(author),
H
Liu
(author),
H
Liu
(author),
A.
Luthra
(author),
A.
Luthra
(author),
H.
Nguyen
(author),
H.
Nguyen
(author),
B.
Shen
(author),
B.
Shen
(author),
V.
Sharma
(author),
V.
Sharma
(author),
S.C.
Simon
(author),
S.C.
Simon
(author),
Juanjuan
Cai
(author),
Juanjuan
Cai
(author),
J.
Cai
(author),
J.
Cai
(author),
Juan-juan
Cai
(author),
Juan-juan
Cai
(author),
Yan
Ma
(author),
Yan
Ma
(author),
Y.
Ma
(author),
Y.
Ma
(author),
Y.
Yang
(author),
Y.
Yang
(author),
L.
Zhang
(author),
L.
Zhang
(author),
L.
Zhang
(author),
L.
Zhang
(author),
L
Zhang
(author),
L
Zhang
(author),
L
Zhang
(author),
L
Zhang
(author),
K.
Zhu
(author),
K.
Zhu
(author),
R.
Zhu
(author),
R.
Zhu
(author),
Ran
Zhu
(author),
Ran
Zhu
(author),
B.
Akgün
(author),
B.
Akgün
(author),
S.
Wagner
(author),
S.
Wagner
(author),
A.
Chatterjee
(author),
A.
Chatterjee
(author),
S.
Das
(author),
S.
Das
(author),
B.A.
Kreis
(author),
B.A.
Kreis
(author),
Y.
Ge
(author),
Y.
Ge
(author),
VB
Kuznetsov
(author),
VB
Kuznetsov
(author),
X.
Shi
(author),
X.
Shi
(author),
Xin
Shi
(author),
Xin
Shi
(author),
W.
Sun
(author),
W.
Sun
(author),
Wei
Sun
(author),
Wei
Sun
(author),
W.Y.
Teo
(author),
W.Y.
Teo
(author),
Y.
Weng
(author),
Y.
Weng
(author),
S.
Banerjee
(author),
S.
Banerjee
(author),
P.
Bhat
(author),
P.
Bhat
(author),
J.G.
Butler
(author),
J.G.
Butler
(author),
H.Y.
Cheung
(author),
H.Y.
Cheung
(author),
D.M.J.
Dykstra
(author),
D.M.J.
Dykstra
(author),
S.
Guo
(author),
S.
Guo
(author),
L.
feng
(author),
L.
feng
(author),
Y.
Guo
(author),
Y.
Guo
(author),
M.K.P.
Johnson
(author),
M.K.P.
Johnson
(author),
C.
Jones
(author),
C.
Jones
(author),
J.
Kaiser
(author),
J.
Kaiser
(author),
C.O.S.
Lei
(author),
C.O.S.
Lei
(author),
S.A.
Los
(author),
S.A.
Los
(author),
K.A.
Mishra
(author),
K.A.
Mishra
(author),
R.V.
Rivera
(author),
R.V.
Rivera
(author),
S.
Ryu
(author),
S.
Ryu
(author),
Z.
Hu
(author),
Z.
Hu
(author),
S.
Sharma
(author),
S.
Sharma
(author),
R.
Smith
(author),
R.
Smith
(author),
R.A.
Vidal
(author),
R.A.
Vidal
(author),
W.
Wu
(author),
W.
Wu
(author),
J.
Yun
(author),
J.
Yun
(author),
M
Chen
(author),
M
Chen
(author),
Y.
Fu
(author),
Y.
Fu
(author),
J.
Gartner
(author),
J.
Gartner
(author),
Johannes
Gartner
(author),
Johannes
Gartner
(author),
B.
Kim
(author),
B.
Kim
(author),
Wang
Da
(author),
Wang
Da
(author),
Wang
Wang
(author),
Wang
Wang
(author),
D.
Wang
(author),
D.
Wang
(author),
Da
Wang
(author),
Da
Wang
(author),
D.
Da
(author),
D.
Da
(author),
Da
Da
(author),
Da
Da
(author),
Y.
MAO
(author),
Y.
MAO
(author),
L.
Kramer
(author),
L.
Kramer
(author),
J.L.
Rodriguez
(author),
J.L.
Rodriguez
(author),
M
Bertoldi
(author),
M
Bertoldi
(author),
J
Chen
(author),
J
Chen
(author),
J.
Haas
(author),
J.
Haas
(author),
K.
Johnson
(author),
K.
Johnson
(author),
M.M.T.
Adams
(author),
M.M.T.
Adams
(author),
MC
Castro
(author),
MC
Castro
(author),
D.
Hofman
(author),
D.
Hofman
(author),
E.
Albayrak
(author),
E.
Albayrak
(author),
S
Qian
(author),
S
Qian
(author),
RO
Briggs
(author),
RO
Briggs
(author),
RO
Briggs
(author),
RO
Briggs
(author),
L.F.K.
Chung
(author),
L.F.K.
Chung
(author),
I
Schmidt
(author),
I
Schmidt
(author),
S.
Sen
(author),
S.
Sen
(author),
J.
Wetzel
(author),
J.
Wetzel
(author),
K.W.A.
Yi
(author),
K.W.A.
Yi
(author),
Z.
Guo
(author),
Z.
Guo
(author),
N.Q.
Tran
(author),
N.Q.
Tran
(author),
Y
Zhang
(author),
Y
Zhang
(author),
Y
Zhang
(author),
Y
Zhang
(author),
S.J.
Sanders
(author),
S.J.
Sanders
(author),
H.H.
Teng
(author),
H.H.
Teng
(author),
T.K.
Bolton
(author),
T.K.
Bolton
(author),
A.
Liu
(author),
A.
Liu
(author),
Z.
Wan
(author),
Z.
Wan
(author),
D.J.
Wright
(author),
D.J.
Wright
(author),
G.
Bauer
(author),
G.
Bauer
(author),
Michael
Chan
(author),
Michael
Chan
(author),
M.
Chan
(author),
M.
Chan
(author),
Y.
Kim
(author),
Y.
Kim
(author),
Y.
Lee
(author),
Y.
Lee
(author),
W
Li
(author),
W
Li
(author),
T.
MA
(author),
T.
MA
(author),
B.
Zhu
(author),
B.
Zhu
(author),
M.
Rudolph
(author),
M.
Rudolph
(author),
S.
Xie
(author),
S.
Xie
(author),
A.
Yoon
(author),
A.
Yoon
(author),
J.H.A.
Mans
(author),
J.H.A.
Mans
(author),
J
Zhang
(author),
J
Zhang
(author),
J
Zhang
(author),
J
Zhang
(author),
D.
Sanders
(author),
D.
Sanders
(author),
D.
Claes
(author),
D.
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Dong Hyun
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Dong Hyun
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The CMS Hadron Calorimeter in the barrel, endcap and forward regions is fully commissioned. Cosmic ray data were taken with and without magnetic field at the surface hall and after installation in the experimental hall, hundred meters underground. Various measurements were also p
...
The CMS Hadron Calorimeter in the barrel, endcap and forward regions is fully commissioned. Cosmic ray data were taken with and without magnetic field at the surface hall and after installation in the experimental hall, hundred meters underground. Various measurements were also performed during the few days of beam in the LHC in September 2008. Calibration parameters were extracted, and the energy response of the HCAL determined from test beam data has been checked.
@en