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document
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Tang, J. (author), Gruber, D. (author), Schelen, J.B.J. (author), Funke, H.J. (author), Beenakker, C.I.M. (author)
Decapsulation of a SOT23 semiconductor package with 23 um copper wire bonds is conducted with an especially designed microwave induced plasma system. It is found that a 30%-60% CF4 addition in the O2/CF4 etchant gas results in high molding compound etching rate. Si3N4 overetching which is encountered in plasma decapsulation is solved by an...
journal article 2012
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document
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Tang, J. (author), Schelen, J.B.J. (author), Beenakker, C.I.M. (author)
Plastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2 mm3/min. The role of O2 and CF4 in etching molding...
journal article 2011
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