Optical Leak Test Method For Assessing The Wafer Bond Quality

Abstract

Hermeticity is a measure of how well a package is leak-tight. Many Micro-Electro-Mechanical Systems (MEMS) sensors, actuators, and microelectronic devices need a defined cavity environment for optimal performance, hence measuring the package leak rate is critical for lifetime prediction. MEMS devices are generally packaged through the wafer-bonding technique. The MEMS device is produced on a wafer with a cavity and bonded to a cap wafer to seal the hole. Reducing the cap wafer thickness allows it to deflect due to the cavity interior-exterior pressure differential. Consequently, if leakage occurs, the deflection will
change. By measuring these deflections, it is possible to quantify leak rates.

In order to use it as an in-line testing process, this research aims to determine the accuracy of the deflection method for determining the leak rates. To achieve this, our approach involved designing and leak testing test structures (or devices) using an experimental setup that can vary pressure, supply desired species
inside a vacuum chamber, and measure deflection using an interferometer to determine leak rates. Deflections are converted to leak rates using a formulated analytical expression, subsequently utilized to determine the error involved in measuring leak rates.

Using the experimental setup, the test devices were effectively characterized for sensitivity using pressure-induced deflection measurements, with experimental sensitivity values closely matching the theory. Further, air leak testing was performed on devices interconnected with nanometer-gap size leak channels to
gain first-hand knowledge of leakage. Experimental leak rates matched well with analytical models, proving that flow through devices having leak channels can be characterized. Ultimately, the setup enabled successful helium leak testing of devices without any defined leak channels.

The helium leak-tested samples were circular membranes of diameters: 2000, 1600, 1400, 1300, and 1100 μm with a thickness of 40 μm bonded to a cavity depth of 3.24 μm. Uncertainty analysis associated with leak rate measurement revealed that when considering a certain cavity depth and membrane thickness,
the membrane with the largest diameter would exhibit the least amount of uncertainty. This was also observed through experiments, for the diameter of 2000 μm, a clear linear trend of deflection reduction due to the helium leakage was observed during a two-week period of deflection measurements. Whereas, for the diameter of 1100 μm, it was not possible to observe the same linear trend of deflection reduction, indicating that even more no.of.days is required to determine an accurate leak rate.

In the end, a short analysis was made using the cavity design having the 2000 μm membrane, which had the least uncertainty in measuring the leak rate. This analysis aimed to ascertain the designed test structure’s usefulness in measuring leak rates of the MEMS packages. Based on the analysis, it was concluded that large-volume wafer-bonded MEMS packages (> 1 mm3) with an acceptable cavity pressure increase of 10 mbar could be tested using the deflection method and our proposed test structure design to guarantee their lifetime.