Flexible system for real-time plasma decapsulation of copper wire bonded ic packages
Conference Paper
(2012)
Author(s)
J Tang (TU Delft - Electronic Components, Technology and Materials)
JBJ Schelen (External organisation)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ECTC.2012.6249076
To reference this document use:
https://resolver.tudelft.nl/uuid:01b97000-5ba1-4e90-9e4a-06afa49f7575
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1764-1769
ISBN (print)
978-146731966-9
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