Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Tang, J.; Beenakker, C.I.M.; Schelen, JBJ

Process control in plasma decapsulation: Preventing damage to the copper wire bonds and controlled removal of Si3N4 passivation layer

Conference paper (2012)

Authors

J. Tang Electronic Components, Technology and Materials

C.I.M. Beenakker Electronic Components, Technology and Materials

JBJ Schelen External organisation

Research Group

Electronic Components, Technology and Materials

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Published Date

2012

Language

English

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Research Group

Electronic Components, Technology and Materials

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