Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer

Journal Article (2011)
Author(s)

K.Y. Wong (TU Delft - Electronic Components, Technology and Materials)

YY Leung (TU Delft - Computational Design and Mechanics)

H. Fan (TU Delft - Applied Geophysics and Petrophysics)

MMF Yuen (External organisation)

Research Group
Electronic Components, Technology and Materials
More Info
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Publication Year
2011
Research Group
Electronic Components, Technology and Materials
Issue number
16
Volume number
25
Pages (from-to)
2081-2099

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