Synergistic toughening of epoxy¿copper interface using a thiol-based coupling layer
Journal Article
(2011)
Author(s)
K.Y. Wong (TU Delft - Electronic Components, Technology and Materials)
YY Leung (TU Delft - Computational Design and Mechanics)
H. Fan (TU Delft - Applied Geophysics and Petrophysics)
MMF Yuen (External organisation)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:03279cee-871d-44b6-b521-b4fa6cafc58e
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Publication Year
2011
Research Group
Electronic Components, Technology and Materials
Issue number
16
Volume number
25
Pages (from-to)
2081-2099
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