A compact 245--310 GHz Balun in 130-nm SiGe BiCMOS technology

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A compact 245--310 GHz Balun in 130-nm SiGe BiCMOS technology

Conference Paper (2025)

Author(s)

Aniello Franzese (IHP–Leibniz-Institut für innovative Mikroelektronik)

Batuhan Sutbas (IHP–Leibniz-Institut für innovative Mikroelektronik)

Volkan Erturk (IHP–Leibniz-Institut für innovative Mikroelektronik)

Thomas Mausolf (IHP–Leibniz-Institut für innovative Mikroelektronik)

David Bierbüsse (RWTH Aachen University)

Renato Negra (RWTH Aachen University)

Ehsan Shokrolahzade (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Marco Spirito (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Corrado Carta (IHP–Leibniz-Institut für innovative Mikroelektronik)

Research Group

Electronics

Transformer Balun Sub-THz SiGe THz 6G

DOI related publication

https://doi.org/10.1109/SiRF63957.2025.11076759 Final published version

To reference this document use

https://resolver.tudelft.nl/uuid:043f400a-8753-441b-b9e4-ef0695c6076a

More Info

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Publication Year

2025

Language

English

Research Group

Electronics

Pages (from-to)

61-63

ISBN (electronic)

9798331507305

Event

24th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (2026-07-31 - 2026-08-02), Stockton-on-Tees, United Kingdom

Abstract

This paper presents a sub-terahertz (sub-THz) balun that leverages stacked-coupled transmission lines (TLs) and a modified Marchand configuration with a reduced electrical length. By rolling up the differential ends as in a transformer-based design, it is demonstrated that the open end of the single-ended winding can be connected to the centre tap. This enables both compact size and the reduction of the parasitic inductance given by the via-to-ground connection. The insertion loss (IL) is only 1.3 dB at 290 GHz, and the design achieves a compact form factor of 0.01mm2 of silicon area, making the proposed balun a suitable interface for differential-to-single-ended circuits in the sub-THz frequencies for 6G applications.