Digital Image Sensor Evolution and New Frontiers

Review (2024)
Author(s)

Eric R. Fossum (Thayer School of Engineering at Dartmouth)

Nobukazu Teranishi (Shizuoka University)

Albert J.P. Theuwissen (Harvest Imaging, Belgium, TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Instrumentation
DOI related publication
https://doi.org/10.1146/annurev-vision-101322-105538 Final published version
More Info
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Publication Year
2024
Language
English
Research Group
Electronic Instrumentation
Issue number
1
Volume number
10
Pages (from-to)
171-198
Downloads counter
221
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Abstract

This article reviews nearly 60 years of solid-state image sensor evolution and identifies potential new frontiers in the field. From early work in the 1960s, through the development of charge-coupled device image sensors, to the complementary metal oxide semiconductor image sensors now ubiquitous in our lives, we discuss highlights in the evolutionary chain. New frontiers, such as 3D stacked technology, photon-counting technology, and others, are briefly discussed.