Interfacial Corrosion Behavior Analysis of Sintered Silver and Sintered Copper Joints for Power Electronics Packaging
Letao Bian (Fudan University)
Xinyue Wang (Fudan University)
Jing Zhang (Heraeus Materials Technology Shanghai Ltd.)
Jianhao Wang (Heraeus Materials Technology Shanghai Ltd.)
G.Q. Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Kim S. Siow (Universiti Kebangsaan Malaysia)
Pan Liu (Research Institute of Fudan University, Ningbo, Fudan University)
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Abstract
This study investigates the corrosion mechanisms at the interfaces of sintered joints exposed to H2S for offshore applications. Through finite element modeling and experimental validation, the galvanic corrosion behavior of four sintered joint configurations was analyzed. Simulation results identified the interface as the primary corrosion zone, with accelerated degradation driven by galvanic coupling. Polarization and electrical conductivity measurements further confirmed that sintered silver maintains corrosion resistance and stable electrical properties after corrosion. This work focused on the interfacial corrosion mechanism and provides insights for offshore power module packages.
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