Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

Journal Article (2007)
Authors

V Gonda (TU Delft - Dynamics of Micro and Nano Systems)

Kaspar Jansen (TU Delft - Computational Design and Mechanics)

LJ Ernst (TU Delft - Computational Design and Mechanics)

J Den Toonder (External organisation)

Guogi Zhang (TU Delft - Computational Design and Mechanics)

Research Group
Dynamics of Micro and Nano Systems
More Info
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Publication Year
2007
Research Group
Dynamics of Micro and Nano Systems
Volume number
47
Pages (from-to)
248-251

Abstract

Advanced micro-mechanical characterization methods provide material properties of thin films for modeling thermo-mechanical behavior of thin films for micro-electronic applications. Here, we focus on the local measurement method of nanoindentation for finding visco-elastic properties, and a global method of substrate curvature testing that provides linear elastic properties. Our specimen SiLK, Dow chemicals, is a low-k dielectric thin polymer film with a thickness of 400 nm, 6 and 8 µm, deposited on Si substrate. Our results show temperature dependent linear elastic and linear visco-elastic material properties for thin film materials.

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