A study on the creep damage of epoxy molding compound in IC package

Liu, S; Qin, L.; Yang, D; Ernst, L.J.; Zhang, GQ

A study on the creep damage of epoxy molding compound in IC package

Conference paper (2003)

Authors

S Liu External organisation

L. Qin External organisation

D Yang Dynamics of Micro and Nano Systems

L.J. Ernst Dynamics of Micro and Nano Systems

GQ Zhang External organisation

Research Group

Dynamics of Micro and Nano Systems

To reference this document use:

http://resolver.tudelft.nl/uuid:1e78466c-5fd9-405f-bbae-f05827a47496

More Info

expand_more

Published Date

2003

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Research Group

Dynamics of Micro and Nano Systems

No files available

Metadata only record. There are no files for this conference paper.