A study on the creep damage of epoxy molding compound in IC package
Conference Paper
(2003)
Author(s)
Shizhuo Liu (External organisation)
L. Qin (External organisation)
D Yang (TU Delft - Dynamics of Micro and Nano Systems)
L.J. Ernst (TU Delft - Dynamics of Micro and Nano Systems)
GQ Zhang (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:1e78466c-5fd9-405f-bbae-f05827a47496
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Publication Year
2003
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
254-259
ISBN (print)
0-7803-8168-8
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