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L. Qin

Conference paper (2)

2 records found

1

Thermal-mechanical stress and fatigue failure analysis of a PBGA

Conference paper (2003) - X Hao (author) , L. Qin (author) , D Yang (author) , S. Liu (author)

A study on the creep damage of epoxy molding compound in IC package

Conference paper (2003) - S Liu (author) , L. Qin (author) , D Yang (author) , L.J. Ernst (author) , GQ Zhang (author)