Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies
Conference Paper
(2007)
Author(s)
M Cannavo (External organisation)
Henk van Zeijl (TU Delft - Electronic Components, Technology and Materials)
G. Pandraud (TU Delft - QN/High Resolution Electron Microscopy)
JV Driel (External organisation)
T Alan (TU Delft - Old - EWI Sect. ECTM)
Pasqualina M. Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:24807606-4bd7-4670-ac84-5596404eee70
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Publication Year
2007
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
509-512
ISBN (print)
978-90-73461-49-9
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