Oxide to oxide wafer bonding for three dimensional (3D) IC integration technologies

Conference paper (2007)

Authors

M Cannavo External organisation
H.W. van Zeijl Electronic Components, Technology and Materials - EEMCS
G. Pandraud QN/High Resolution Electron Microscopy
JV Driel External organisation
T Alan Old - EWI Sect. ECTM
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2007

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials