Thermally induced delamination-buckling in a copper-ceramic microelectronic product

Liu, CJ; Zhang, G.Q.; Ernst, L.J.; Wisse, G.

Thermally induced delamination-buckling in a copper-ceramic microelectronic product

Conference paper (2001)

Authors

CJ Liu External organisation

G.Q. Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

G. Wisse Dynamics of Micro and Nano Systems

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2001

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Research Group

Dynamics of Micro and Nano Systems

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