Opportunities for applications of electrochemical deposition of copper for filling holes and channals in silicon wafer structures
Journal Article
(2001)
Author(s)
VG Kiutchukov (External organisation)
Ph Philipov (External organisation)
Christian Schmidt (External organisation)
University
Delft University of Technology
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https://resolver.tudelft.nl/uuid:2d1b8783-6b27-4601-a52a-b63fdcaa8435
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Publication Year
2001
University
Delft University of Technology
Issue number
3-4
Volume number
35
Pages (from-to)
8-10
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