Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates
Conference Paper
(1999)
University
Delft University of Technology
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https://resolver.tudelft.nl/uuid:313c1e20-9d4f-41a5-a138-540cc63315b0
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Publication Year
1999
University
Delft University of Technology
Pages (from-to)
145-159
ISBN (print)
0861-0797
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