18 records found
1
Novel wafer-through technique for interconnects
Through-wafer copper electroplating for 3-D interconnects
Forming rounded convex corner by using two-step anisotropic koh wet etching
Through-wafer copper plugs formation for 3-dimensional ICs
Trough-wafer copper plugs formation for 3-Dimensional ICs
Though-wafer copper electropating for 3-D interconnects
New fabrication technology for wafer-through hole interconnects
Patterning of polyimide and metal in deep trenches
Coating of deep anisotropically etched grooves with polymide and photoresist
Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]
Patterning of polyimide and metal in deep grooves
New photoresist coating method for 3-D structured wafers
Etching behavior of KOH at the convex corner
Novel method for spinning of photoresist on wafers with through-holes
Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching
Uniform photoresist coating of anisotropically etched cavities in silicon
Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates
