18 records found
1
Though-wafer copper electropating for 3-D interconnects
Novel wafer-through technique for interconnects
Forming rounded convex corner by using two-step anisotropic koh wet etching
Through-wafer copper plugs formation for 3-dimensional ICs
Trough-wafer copper plugs formation for 3-Dimensional ICs
Through-wafer copper electroplating for 3-D interconnects
New fabrication technology for wafer-through hole interconnects
Patterning of polyimide and metal in deep trenches
Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]
New photoresist coating method for 3-D structured wafers
Coating of deep anisotropically etched grooves with polymide and photoresist
Patterning of polyimide and metal in deep grooves
Etching behavior of KOH at the convex corner
Uniform photoresist coating of anisotropically etched cavities in silicon
Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates
Novel method for spinning of photoresist on wafers with through-holes
Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching
