Through-wafer copper plugs formation for 3-dimensional ICs

Nguyen, NT; Boellaard, E; Pham, PN; Kiutchoukov, VG; Cracium, G; Sarro, Pasqualina M.

Through-wafer copper plugs formation for 3-dimensional ICs

Conference paper (2001)

Authors

NT Nguyen Electronic Components, Technology and Materials

E Boellaard Electronic Components, Technology and Materials

PN Pham Electronic Components, Technology and Materials

VG Kiutchoukov External organisation

G Cracium External organisation

Pasqualina M. Sarro Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2001

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Research Group

Electronic Components, Technology and Materials

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