P
PN Pham
Authored
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The cost of the photoresist coating process is a major component of the cost of ownership in semiconductor manufacturing. Minimizing the volume of resist used in coating applications results in lower manufacturing costs by reducing both chemical consumption and waste disposal cos
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Conventional spin-coating methods for photoresist deposition give poor results for MEMS and other applications where a conformal resist layer is required over wafer surfaces with large topography.We have developed a coating tool for use with electro-depositable resist that gives
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