Time dependent behavior of concrete in tension

Through-chip connections

Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

3D molecular interconnection technology

Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

High aspect ratio through-wafer interconnections for 3D-microsystems

Through-wafer copper electroplating for three-dimensional interconnects

Realization of high aspect ratio interconnections based on macroporous silicon

Through-wafer copper electroplating for RF silicon technology

Through-wafer copper electroplating for three-dimensional interconnects

Report on chip-stack technologies: WP 4 (CORTEX)

Through-wafer copper electroplating for 3-D interconnects

Trough-wafer copper plugs formation for 3-Dimensional ICs

Though-wafer copper electropating for 3-D interconnects

Design and construction of elements of a hybrid molecular/electronic Retina-Cortex structure (CORTEX)

Through-wafer copper plugs formation for 3-dimensional ICs