Time dependent behavior of concrete in tension

Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Through-chip connections

3D molecular interconnection technology

Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

High aspect ratio through-wafer interconnections for 3D-microsystems

Through-wafer copper electroplating for RF silicon technology

Realization of high aspect ratio interconnections based on macroporous silicon

Through-wafer copper electroplating for three-dimensional interconnects

Through-wafer copper electroplating for three-dimensional interconnects

Through-wafer copper plugs formation for 3-dimensional ICs

Through-wafer copper electroplating for 3-D interconnects

Design and construction of elements of a hybrid molecular/electronic Retina-Cortex structure (CORTEX)

Trough-wafer copper plugs formation for 3-Dimensional ICs

Report on chip-stack technologies: WP 4 (CORTEX)

Though-wafer copper electropating for 3-D interconnects