NT Nguyen

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Book chapter (1)

Conference paper (2)

3 records found

Through-chip connections

Book chapter (2004) - PM Sarro, L Wang, NT Nguyen

Realization of high aspect ratio interconnections based on macroporous silicon

Conference paper (2002) - A Nichelatti, NT Nguyen, PM Sarro

Through-wafer copper electroplating for RF silicon technology

Conference paper (2002) - NT Nguyen, TK Ng, E Boellaard, NP Pham, G Craciun, PM Sarro, JN Burghartz