N

NT Nguyen

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Authored

16 records found

Time dependent behavior of concrete in tension
Abstract - NT Nguyen, J.C. Walraven

Realization of high aspect ratio interconnections based on macroporous silicon

Trough-wafer copper plugs formation for 3-Dimensional ICs

Design and construction of elements of a hybrid molecular/electronic Retina-Cortex structure (CORTEX)

Though-wafer copper electropating for 3-D interconnects

Through-wafer copper electroplating for three-dimensional interconnects

Through-chip connections

Through-wafer copper electroplating for three-dimensional interconnects

Through-wafer copper electroplating for RF silicon technology

Through-wafer copper electroplating for 3-D interconnects

Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications

3D molecular interconnection technology

High aspect ratio through-wafer interconnections for 3D-microsystems

Through-wafer copper plugs formation for 3-dimensional ICs

Report on chip-stack technologies: WP 4 (CORTEX)