Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Journal article (2004)

Authors

C Videlot External organisation
J Ackermann External organisation
F Fages External organisation
NT Nguyen Electronic Components, Technology and Materials - EEMCS
L Wang Electronic Components, Technology and Materials - EEMCS
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
D Crawly External organisation
K Nikolic External organisation
M Forshaw External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2004

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials