Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

C Videlot (External organisation)

J Ackermann (External organisation)

F Fages (External organisation)

NT Nguyen (TU Delft - Electronic Components, Technology and Materials)

L Wang (TU Delft - Electronic Components, Technology and Materials)

Pasqualina Sarro (TU Delft - Electronic Components, Technology and Materials)

D Crawly (External organisation)

K Nikolic (External organisation)

M Forshaw (External organisation)