Through-wafer copper electroplating for three-dimensional interconnects

Journal article (2002)

Authors

NT Nguyen Electronic Components, Technology and Materials -

E Boellaard Electronic Components, Technology and Materials -

NP Pham Electronic Components, Technology and Materials -

VG Kutchoukov Electronic Instrumentation -

G Craciun Electronic Instrumentation -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Elektrotechniek Techniek

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http://resolver.tudelft.nl/uuid:6d6b33ea-50fb-440f-989a-388300248771

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Published Date

2002

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials