Trough-wafer copper plugs formation for 3-Dimensional ICs
Conference Paper
(2001)
Author(s)
NT Nguyen (TU Delft - Electronic Components, Technology and Materials)
E Boellaard (TU Delft - Electronic Components, Technology and Materials)
PN Pham (TU Delft - Electronic Components, Technology and Materials)
VG Kiutchoukov (External organisation)
G Cracium (External organisation)
PM Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:55a548ee-fbf6-4bcf-bed8-bf6cc136777e
More Info
expand_more
expand_more
Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
141-144
ISBN (print)
90-73461-29-4
No files available
Metadata only record. There are no files for this record.