8 records found
1
Through-wafer copper plugs formation for 3-dimensional ICs
Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures
High aspect ratio cryogenic etching of silicon with SF6/O2 plasma
Though-wafer copper electropating for 3-D interconnects
Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining
Through-wafer copper electroplating for 3-D interconnects
Trough-wafer copper plugs formation for 3-Dimensional ICs
Temperature influence on etching deep holes with SF6/O2 cryogenic plasma