GC

G Cracium

8 records found

Authored

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma
Conference paper (2001) - G Cracium, MA Blauw, Pasqualina M Sarro, P.J. French

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures
Conference paper (2001) - G Cracium, MA Blauw, E.W.J.M. van der Drift, P.J. French

Through-wafer copper plugs formation for 3-dimensional ICs

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining
Conference paper (2001) - MA Blauw, G Cracium, P.J. French

Though-wafer copper electropating for 3-D interconnects

High aspect ratio cryogenic etching of silicon with SF6/O2 plasma
Conference paper (2001) - G Cracium, MA Blauw, E.W.J.M. van der Drift, P.J. French

Trough-wafer copper plugs formation for 3-Dimensional ICs

Through-wafer copper electroplating for 3-D interconnects