Climate change resistant coastline by biological in-situ reinforcement of sand

Deep reactive ion etching in through-silicon via technology

Control of the ion-distribution and measurement of ion currents with a non-sinusoidal substrate bias

Deep anisotropic dry etching of silicon microstructures by high-density plasmas

Dry etching of SiC in inductively coupled Cl-2/Ar plasma

Modeling of fluorine-based high-density plasma etching of anisotropic silicon trenches with oxygen sidewall passivation

The etching of silicon carbide in inductively coupled SF6/O-2 plasma

Processing of inertial sensors using SF6-O2 Cryogenic plasma process

IC-compatible processing of inertial sensors using SF6-O2 cryogenic plasma process

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma

Advanced time-multiplexed plasma etching of high aspect ratio silicon structures

Single step cryogenic SF6/O2 plasma etching process for the development of inertial devices

Single step cryogenic SF6/O2 plasma etching process for the development of a novel quad gyroscope

Limitations and complementary value of cryogenic SF6-O2 and Bosch plasma etch process for silicon micromachining

Aspect ratio and crystallographic orientation dependence in deep dry silicon etching at cryogenic temperatures.

High aspect ratio cyrogenic etching of Silicon with SF6/O2 plasma.

High aspect ratio cryogenic etching of silicon with SF6/O2 plasma

Balancing the etching and passivation in time-multiplexed deep dry etching of silicon.

Temperature influence on etching deep holes with SF6/O2 cryogenic plasma.

Development of deep dry etching for intelligent mocromachine devices.