Though-wafer copper electropating for 3-D interconnects
Conference Paper
(2001)
Author(s)
NT Nguyen (TU Delft - Electronic Components, Technology and Materials)
E Boellaard (TU Delft - Electronic Components, Technology and Materials)
PN Pham (TU Delft - Electronic Components, Technology and Materials)
VG Kiutchoukov (External organisation)
G Cracium (External organisation)
PM Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:1909bd55-ba56-4595-a97b-ec1c70d34dd0
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Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
74-77
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