Through-wafer copper electroplating for 3-D interconnects

Conference paper (2001)

Authors

NT Nguyen Electronic Components, Technology and Materials - EEMCS
E Boellaard Electronic Components, Technology and Materials - EEMCS
HMT Pham External organisation
VG Kiutchoukov External organisation
G Cracium External organisation
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2001

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials