Through-wafer copper electroplating for 3-D interconnects
Conference Paper
(2001)
Author(s)
NT Nguyen (TU Delft - Electronic Components, Technology and Materials)
E Boellaard (TU Delft - Electronic Components, Technology and Materials)
HMT Pham (External organisation)
VG Kiutchoukov (External organisation)
G Cracium (External organisation)
Pasqualina Maria Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:4108ac95-af6e-4db5-8b71-30f7c7349989
More Info
expand_more
expand_more
Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
74-77
No files available
Metadata only record. There are no files for this record.